JPS566448A - Mos type integrated circuit device - Google Patents

Mos type integrated circuit device

Info

Publication number
JPS566448A
JPS566448A JP8192579A JP8192579A JPS566448A JP S566448 A JPS566448 A JP S566448A JP 8192579 A JP8192579 A JP 8192579A JP 8192579 A JP8192579 A JP 8192579A JP S566448 A JPS566448 A JP S566448A
Authority
JP
Japan
Prior art keywords
oxide film
silicone
film
layer
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8192579A
Other languages
English (en)
Inventor
Hiroshi Ikejima
Kuniyuki Hamano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP8192579A priority Critical patent/JPS566448A/ja
Publication of JPS566448A publication Critical patent/JPS566448A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Formation Of Insulating Films (AREA)
JP8192579A 1979-06-28 1979-06-28 Mos type integrated circuit device Pending JPS566448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8192579A JPS566448A (en) 1979-06-28 1979-06-28 Mos type integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8192579A JPS566448A (en) 1979-06-28 1979-06-28 Mos type integrated circuit device

Publications (1)

Publication Number Publication Date
JPS566448A true JPS566448A (en) 1981-01-23

Family

ID=13760030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8192579A Pending JPS566448A (en) 1979-06-28 1979-06-28 Mos type integrated circuit device

Country Status (1)

Country Link
JP (1) JPS566448A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136974A (ja) * 1984-07-30 1986-02-21 Matsushita Electronics Corp Ｍｏｓ型半導体装置の製造方法
JPH04179725A (ja) * 1990-11-14 1992-06-26 Ohbayashi Corp 鋼管矢板工法における継手部の止水工法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136974A (ja) * 1984-07-30 1986-02-21 Matsushita Electronics Corp Ｍｏｓ型半導体装置の製造方法
JPH0527995B2 (ja) * 1984-07-30 1993-04-22 Matsushita Electronics Corp
JPH04179725A (ja) * 1990-11-14 1992-06-26 Ohbayashi Corp 鋼管矢板工法における継手部の止水工法

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