JPS5660028A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5660028A JPS5660028A JP13547479A JP13547479A JPS5660028A JP S5660028 A JPS5660028 A JP S5660028A JP 13547479 A JP13547479 A JP 13547479A JP 13547479 A JP13547479 A JP 13547479A JP S5660028 A JPS5660028 A JP S5660028A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- polycrystalline
- noncrystalline
- silicon layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
Abstract
PURPOSE:To prevent the formation of a bird beak at the end of the interelement insulation isolation region of the subject semiconductor device by a method wherein a polycrystalline or a noncrystalline semiconductor layer is coated on the surface of the semiconductor substrate surrounded by an insulating film and is converted to single crystal using a laser beam or an electron beam. CONSTITUTION:An insulating film 11 with a desired thickness is formed on the surface of a silicon substrate 10 and the insulating film is selectively removed by a plasma etching method or the like using a photoresist film 13 as a mask. After that, a polycrystalline silicon layer on noncrystalline silicon layers 14 and 14' are formed on an aperture 12 and the resist film 13 with the same thickness as that of the insulating film 11. Then the resist film 13 and the silicon layer above the film 13 are removed. Next, the polycrystalline or noncrystalline silicon layer is converted to single crystal by irradiating a laser beam or an electron beam and an element forming region 15 is formed. When forming a junction 4 by an ion injection, a flat junction can be hereby formed with an unbent end section 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13547479A JPS5660028A (en) | 1979-10-19 | 1979-10-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13547479A JPS5660028A (en) | 1979-10-19 | 1979-10-19 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5660028A true JPS5660028A (en) | 1981-05-23 |
JPS6239531B2 JPS6239531B2 (en) | 1987-08-24 |
Family
ID=15152552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13547479A Granted JPS5660028A (en) | 1979-10-19 | 1979-10-19 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5660028A (en) |
-
1979
- 1979-10-19 JP JP13547479A patent/JPS5660028A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6239531B2 (en) | 1987-08-24 |
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