JPS5642335A - Zinc diffusion to 3-5 group compound semiconductor - Google Patents

Zinc diffusion to 3-5 group compound semiconductor

Info

Publication number
JPS5642335A
JPS5642335A JP11827779A JP11827779A JPS5642335A JP S5642335 A JPS5642335 A JP S5642335A JP 11827779 A JP11827779 A JP 11827779A JP 11827779 A JP11827779 A JP 11827779A JP S5642335 A JPS5642335 A JP S5642335A
Authority
JP
Japan
Prior art keywords
substrate
compound semiconductor
density
group compound
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11827779A
Other languages
Japanese (ja)
Inventor
Osamu Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11827779A priority Critical patent/JPS5642335A/en
Publication of JPS5642335A publication Critical patent/JPS5642335A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To diffuse the zinc in high density distribution at a surface and low density at an inside of a substrate by a method wherein ZnAs2 or ZnP2 and III-V group compound semiconductor wafers are vacuum sealed in the same container and wafers are preserve at a high temperature. CONSTITUTION:To diffuse the Zn on the III-V group compound semiconductor at low density, there are a method using GaZn alloy, a method that an SiO2 mask is coated on the GaAs substrate, and Zn is diffused through the mask or others, but there are problems for the weighing of the diffusion source or a complexness of the process, further the surface density will be reduced when the inside densisty of wafer is lowered, it is very difficult to form an excellent ohmic connection. For this reason the ZnAs2 2 as the diffusion source is vacuum sealed in a quartz pipe 1 with the GaAs substrate 3, and make the temperature of the diffusion source 2 and the substrate 3 as T2, T1, when T1 is preserved at 700-900 deg.C, T2 at 600-700 deg.C, the Zn density can be diffused in the high distribution at the surface of substrate, in the low distribution at the inside. Such a method is simple and very advantageous for the manufacturing of LED or others.
JP11827779A 1979-09-14 1979-09-14 Zinc diffusion to 3-5 group compound semiconductor Pending JPS5642335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11827779A JPS5642335A (en) 1979-09-14 1979-09-14 Zinc diffusion to 3-5 group compound semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11827779A JPS5642335A (en) 1979-09-14 1979-09-14 Zinc diffusion to 3-5 group compound semiconductor

Publications (1)

Publication Number Publication Date
JPS5642335A true JPS5642335A (en) 1981-04-20

Family

ID=14732662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11827779A Pending JPS5642335A (en) 1979-09-14 1979-09-14 Zinc diffusion to 3-5 group compound semiconductor

Country Status (1)

Country Link
JP (1) JPS5642335A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04364027A (en) * 1991-06-10 1992-12-16 Victor Co Of Japan Ltd Diffusion of zn into gaas
US5506186A (en) * 1988-06-27 1996-04-09 U.S. Philips Corporation Method of manufacturing an optoelectronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506186A (en) * 1988-06-27 1996-04-09 U.S. Philips Corporation Method of manufacturing an optoelectronic device
JPH04364027A (en) * 1991-06-10 1992-12-16 Victor Co Of Japan Ltd Diffusion of zn into gaas

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