JPS55107257A - Ohmic electrode - Google Patents
Ohmic electrodeInfo
- Publication number
- JPS55107257A JPS55107257A JP1387979A JP1387979A JPS55107257A JP S55107257 A JPS55107257 A JP S55107257A JP 1387979 A JP1387979 A JP 1387979A JP 1387979 A JP1387979 A JP 1387979A JP S55107257 A JPS55107257 A JP S55107257A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- copper
- metal
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve yield simultaneously with making manufacturing easy by using metal whose main part is copper including II group elements for electrode metal when providing an ohmic electrode on a P-type III-V group compound semiconductor.
CONSTITUTION: When coating an ohmic electrode 2 on a p-type III-V group compound semiconductor substrate 1 of indium arsenide, etc., copper of purity of 99.99% including 30 atomic percent preferably 5 atomic percent of zinc of purity also of 99.99% is used for the electrode metal. Zinc and copper are measured and sealed in a quartz ampule of about 10-6Torr, then heated above 1100°C and made into an alloy. Next, the substrate 1 is heated to 125°C, the degree of vacuum of its atmosphere is made to 10-6Torr, the alloy is deposited on the substrate and a metal electrode 2 is formed. Then, covering the surface with an oxidation preventive film 3 via a thin gold layer and heat-treating in hydrogen atmosphere at 150°C for 15min, a P+-type zinc diffusion layer 4 is formed on the surface of the substrate 1. Using the layer 4 so obtained, carrier concentration there is increased and electric resistance is reduced.
COPYRIGHT: (C)1980,JPO&Japio
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13879A JPS54109930A (en) | 1978-01-09 | 1979-01-08 | Long chain fatty acid amides and hydrazides* their cyclopropano analogue* their manufacture and use |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55107257A true JPS55107257A (en) | 1980-08-16 |
Family
ID=11465659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1387979A Pending JPS55107257A (en) | 1979-01-08 | 1979-02-09 | Ohmic electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55107257A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130274A (en) * | 1991-04-05 | 1992-07-14 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
US5243222A (en) * | 1991-04-05 | 1993-09-07 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
-
1979
- 1979-02-09 JP JP1387979A patent/JPS55107257A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130274A (en) * | 1991-04-05 | 1992-07-14 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
US5243222A (en) * | 1991-04-05 | 1993-09-07 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
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