JPS563692A - Method and apparatus for high speed plating - Google Patents

Method and apparatus for high speed plating

Info

Publication number
JPS563692A
JPS563692A JP7948679A JP7948679A JPS563692A JP S563692 A JPS563692 A JP S563692A JP 7948679 A JP7948679 A JP 7948679A JP 7948679 A JP7948679 A JP 7948679A JP S563692 A JPS563692 A JP S563692A
Authority
JP
Japan
Prior art keywords
electrolyte
plated
diaphragm
anode
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7948679A
Other languages
Japanese (ja)
Inventor
Toshiji Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOOKEN KK
Koken Co Ltd
Original Assignee
KOOKEN KK
Koken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOOKEN KK, Koken Co Ltd filed Critical KOOKEN KK
Priority to JP7948679A priority Critical patent/JPS563692A/en
Publication of JPS563692A publication Critical patent/JPS563692A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To improve the operation efficiency and quality, by dipping the anode and cathode as the material to be plated in electrolyte bath and putting porous anticorrosive diaphragm between both electrodes and then, providing each device of liquid temperature control and electrolyte supplement addition.
CONSTITUTION: The anode 2 and the cathode 3 as the material to be plated, are dipped in the electrolyte 6 in the electrolytic bath 1. Both electrodes are separated by the diaphragm 4 made of polyester or glass fiber membrane having meshes of 4W10μ. Temperature of the electrolyte is controlled within the range of 25W 60°C by the liquid temperature control device 7, such as heat exchange system, etc. and on occasion demands, the electrolyte 6 is supplied by the electrolyte supplement addition device 8. Current is turned on from the direct current power source 5 and the material to be plated is plated through the diaphragm 4 when voltage is increased and current capacity is reached 100W300A/cm2. Plating speed is 1W5min/ 10μ.
COPYRIGHT: (C)1981,JPO&Japio
JP7948679A 1979-06-23 1979-06-23 Method and apparatus for high speed plating Pending JPS563692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7948679A JPS563692A (en) 1979-06-23 1979-06-23 Method and apparatus for high speed plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7948679A JPS563692A (en) 1979-06-23 1979-06-23 Method and apparatus for high speed plating

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3505985A Division JPS6184396A (en) 1985-02-22 1985-02-22 High-speed plating method

Publications (1)

Publication Number Publication Date
JPS563692A true JPS563692A (en) 1981-01-14

Family

ID=13691220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7948679A Pending JPS563692A (en) 1979-06-23 1979-06-23 Method and apparatus for high speed plating

Country Status (1)

Country Link
JP (1) JPS563692A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986002671A1 (en) * 1984-10-31 1986-05-09 Koken Co., Ltd. Plating device and plating method
FR2686352A1 (en) * 1992-01-16 1993-07-23 Framatome Sa APPARATUS AND METHOD FOR ELECTROLYTIC COATING OF NICKEL.
JP2003027276A (en) * 2001-07-11 2003-01-29 Ricoh Co Ltd Method for manufacturing substrate for electrophotographic photoreceptor
JP2008088520A (en) * 2006-10-03 2008-04-17 Nisshin Kasei Kk Plating method
KR100927196B1 (en) 2009-08-25 2009-11-18 주식회사 세미유 Plasma electrolysing oxcidation device for mg alloys goods

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135834A (en) * 1977-04-29 1978-11-27 Olin Corp Method of lowering overvoltage in electrolyte tank and its device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135834A (en) * 1977-04-29 1978-11-27 Olin Corp Method of lowering overvoltage in electrolyte tank and its device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986002671A1 (en) * 1984-10-31 1986-05-09 Koken Co., Ltd. Plating device and plating method
FR2686352A1 (en) * 1992-01-16 1993-07-23 Framatome Sa APPARATUS AND METHOD FOR ELECTROLYTIC COATING OF NICKEL.
US5403460A (en) * 1992-01-16 1995-04-04 Framatome Method and apparatus for nickel electro-plating
JP2003027276A (en) * 2001-07-11 2003-01-29 Ricoh Co Ltd Method for manufacturing substrate for electrophotographic photoreceptor
JP4657510B2 (en) * 2001-07-11 2011-03-23 株式会社リコー Manufacturing method of substrate for electrophotographic photosensitive member
JP2008088520A (en) * 2006-10-03 2008-04-17 Nisshin Kasei Kk Plating method
KR100927196B1 (en) 2009-08-25 2009-11-18 주식회사 세미유 Plasma electrolysing oxcidation device for mg alloys goods

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