JPS5636147A - Semiconductor device and its manufacture - Google Patents
Semiconductor device and its manufactureInfo
- Publication number
- JPS5636147A JPS5636147A JP11189479A JP11189479A JPS5636147A JP S5636147 A JPS5636147 A JP S5636147A JP 11189479 A JP11189479 A JP 11189479A JP 11189479 A JP11189479 A JP 11189479A JP S5636147 A JPS5636147 A JP S5636147A
- Authority
- JP
- Japan
- Prior art keywords
- film
- wiring
- hole portion
- lead
- opened hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11189479A JPS5636147A (en) | 1979-08-31 | 1979-08-31 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11189479A JPS5636147A (en) | 1979-08-31 | 1979-08-31 | Semiconductor device and its manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5636147A true JPS5636147A (en) | 1981-04-09 |
JPS6318335B2 JPS6318335B2 (uk) | 1988-04-18 |
Family
ID=14572797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11189479A Granted JPS5636147A (en) | 1979-08-31 | 1979-08-31 | Semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5636147A (uk) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6331565U (uk) * | 1986-08-14 | 1988-03-01 | ||
JPH01181540A (ja) * | 1988-01-15 | 1989-07-19 | Internatl Business Mach Corp <Ibm> | Tabパツケージ |
JPH02119253A (ja) * | 1988-10-28 | 1990-05-07 | Nec Corp | 混成集積回路装置 |
WO1996004682A1 (en) * | 1994-07-29 | 1996-02-15 | Havant International Limited | Electronic circuit package |
JP2001209774A (ja) * | 2000-01-25 | 2001-08-03 | Hitachi Cable Ltd | Icカード及びその製造方法 |
-
1979
- 1979-08-31 JP JP11189479A patent/JPS5636147A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6331565U (uk) * | 1986-08-14 | 1988-03-01 | ||
JPH01181540A (ja) * | 1988-01-15 | 1989-07-19 | Internatl Business Mach Corp <Ibm> | Tabパツケージ |
JPH0534826B2 (uk) * | 1988-01-15 | 1993-05-25 | Intaanashonaru Bijinesu Mashiinzu Corp | |
JPH02119253A (ja) * | 1988-10-28 | 1990-05-07 | Nec Corp | 混成集積回路装置 |
WO1996004682A1 (en) * | 1994-07-29 | 1996-02-15 | Havant International Limited | Electronic circuit package |
JP2001209774A (ja) * | 2000-01-25 | 2001-08-03 | Hitachi Cable Ltd | Icカード及びその製造方法 |
JP4529216B2 (ja) * | 2000-01-25 | 2010-08-25 | 凸版印刷株式会社 | Icカード及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6318335B2 (uk) | 1988-04-18 |
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