JPS5632743A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5632743A JPS5632743A JP10783679A JP10783679A JPS5632743A JP S5632743 A JPS5632743 A JP S5632743A JP 10783679 A JP10783679 A JP 10783679A JP 10783679 A JP10783679 A JP 10783679A JP S5632743 A JPS5632743 A JP S5632743A
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- substrate
- grooves
- dividing
- dividing lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To avoid contamination of the main surface of a semiconductor substrate in the semiconductor device by forming grooves necessary to divide the substrate on the other opposite side main surface thereof when dividing semiconductor element group formed on one main surface of the substrate into unit elements and dividing the substrate along the grooves into the unit elements. CONSTITUTION:Unit elements 4 are formed on one main surface 2 of the semiconductor substrate 1, dividing lines 5 are formed around the elements 4, one main surface 2 is placed through a protecting transparent thin film 7 on a ringlike table 10 while directing the dividing lines 5 downwardly. Subsequently, a laser light source 8 is arranged on the opposite side main surface 3 of the substrate 1, and a position detector 9 such as a reflection type optical microscope or the like is arranged coaxially with the source 8 on the main surface 2 side, a laser light is irradiated to the opposite main surface 3, the table 10 is simultaneously moved together with the substrate 1 thereon, and the light source 8 and the detector 9 are coaxially moved with the dividing lines 5. Thus there are formed molten grooves 6 confronting the dividing lines 5, and the substrate is divided into the unit element 4 by using a dicing saw or the like along the grooves 6 as reference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10783679A JPS5632743A (en) | 1979-08-24 | 1979-08-24 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10783679A JPS5632743A (en) | 1979-08-24 | 1979-08-24 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5632743A true JPS5632743A (en) | 1981-04-02 |
Family
ID=14469268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10783679A Pending JPS5632743A (en) | 1979-08-24 | 1979-08-24 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5632743A (en) |
-
1979
- 1979-08-24 JP JP10783679A patent/JPS5632743A/en active Pending
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