JPS5493956A - Cutting method of semiconductor element - Google Patents

Cutting method of semiconductor element

Info

Publication number
JPS5493956A
JPS5493956A JP75078A JP75078A JPS5493956A JP S5493956 A JPS5493956 A JP S5493956A JP 75078 A JP75078 A JP 75078A JP 75078 A JP75078 A JP 75078A JP S5493956 A JPS5493956 A JP S5493956A
Authority
JP
Japan
Prior art keywords
substrate
transparent plate
face
scribed
appear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP75078A
Other languages
Japanese (ja)
Inventor
Yoshio Takagi
Kunihiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP75078A priority Critical patent/JPS5493956A/en
Publication of JPS5493956A publication Critical patent/JPS5493956A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To reduce the number of cutting processes by forming a volatile film on all the surface of or around the semiconductor substrate sticked to a transparent plate and scribing the substrate from one face and scribing the substrate from the other face according to scribed lines which appear through the transparent plate.
CONSTITUTION: Semiconductor substrate 2 where element patterns are arranged is sticked to one face of transparent plate 4 which consists of materials transparent to visible or infrared rays, and film 5 consititing of materials absorbing easily visible or infrared rays is formed on all the surface of or around transparent plate. Substrate 2 including transparent plate 4 is scribed by laser beam according to an element pattern pitch, and cut grooves are provided on one face substrate 2, and scribed lines 6 are caused to appear in the part of film 5. Transparent plate 4 is turned over, and the substrate is scribed according to lines 6 which appear on the reverse face, thereby separating the substrate into individual element chips.
COPYRIGHT: (C)1979,JPO&Japio
JP75078A 1978-01-06 1978-01-06 Cutting method of semiconductor element Pending JPS5493956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP75078A JPS5493956A (en) 1978-01-06 1978-01-06 Cutting method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP75078A JPS5493956A (en) 1978-01-06 1978-01-06 Cutting method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5493956A true JPS5493956A (en) 1979-07-25

Family

ID=11482365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP75078A Pending JPS5493956A (en) 1978-01-06 1978-01-06 Cutting method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5493956A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013136073A (en) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd Method for splitting workpiece and method for splitting substrate with optical element pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013136073A (en) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd Method for splitting workpiece and method for splitting substrate with optical element pattern

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