JPS5623370A - Solder device - Google Patents

Solder device

Info

Publication number
JPS5623370A
JPS5623370A JP9824279A JP9824279A JPS5623370A JP S5623370 A JPS5623370 A JP S5623370A JP 9824279 A JP9824279 A JP 9824279A JP 9824279 A JP9824279 A JP 9824279A JP S5623370 A JPS5623370 A JP S5623370A
Authority
JP
Japan
Prior art keywords
substrate
solder
soldering
cell
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9824279A
Other languages
Japanese (ja)
Other versions
JPS6333938B2 (en
Inventor
Hideaki Kusumoto
Takao Maeda
Katsumi Kubo
Takeshi Kitazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP9824279A priority Critical patent/JPS5623370A/en
Publication of JPS5623370A publication Critical patent/JPS5623370A/en
Publication of JPS6333938B2 publication Critical patent/JPS6333938B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE: To perform good quality soldering by specifically pulling a printed substrate from a solder cell while horizontally moving a carriage elevatably and tiltably supporting a printed substrate holder along the solder cell and matching the retreating of the solder column boundary face and the advancing of said substrate.
CONSTITUTION: A printed substrate 10 is set in a substrate holder 24, and the holder 24 is brought closer to a solder cell 12 in an ascended state by a control mechanism. When the holder 24 reaches just before the cell 12 on account of the equal speed moving of a carriage 16, the 1st and 45°-delayed 2nd cam devices 28, 30 are moved simultaneously. As a result, the substrate comes to the position B-B line from the A-A line and the leading edge of the substrate adjoins to the solder liquid level X-X , thence soldering is started. The trailing edge of the substrate is gradually continued of soldering and the substrate is supported at height X-X. After this solder bath, the substrate is still moved horizontally at an equal speed and while its trailing edge is being held on the solder liquid surface, the leading edge is raised gradually. If a solder column boundary face retreating speed (h) and a substrate advancing speed H are made equal, the solder columns do not cause disturbing motion, thus uniform soldering may be performed.
COPYRIGHT: (C)1981,JPO&Japio
JP9824279A 1979-07-31 1979-07-31 Solder device Granted JPS5623370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9824279A JPS5623370A (en) 1979-07-31 1979-07-31 Solder device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9824279A JPS5623370A (en) 1979-07-31 1979-07-31 Solder device

Publications (2)

Publication Number Publication Date
JPS5623370A true JPS5623370A (en) 1981-03-05
JPS6333938B2 JPS6333938B2 (en) 1988-07-07

Family

ID=14214485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9824279A Granted JPS5623370A (en) 1979-07-31 1979-07-31 Solder device

Country Status (1)

Country Link
JP (1) JPS5623370A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) * 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) * 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath

Also Published As

Publication number Publication date
JPS6333938B2 (en) 1988-07-07

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