JPS5540076A - Soldering method of automatic soldering device - Google Patents

Soldering method of automatic soldering device

Info

Publication number
JPS5540076A
JPS5540076A JP11333478A JP11333478A JPS5540076A JP S5540076 A JPS5540076 A JP S5540076A JP 11333478 A JP11333478 A JP 11333478A JP 11333478 A JP11333478 A JP 11333478A JP S5540076 A JPS5540076 A JP S5540076A
Authority
JP
Japan
Prior art keywords
end part
soaked
order
solder
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11333478A
Other languages
Japanese (ja)
Other versions
JPS614308B2 (en
Inventor
Takehiro Kudo
Terumi Nakahara
Sueo Yamada
Yoshiharu Fukuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11333478A priority Critical patent/JPS5540076A/en
Publication of JPS5540076A publication Critical patent/JPS5540076A/en
Publication of JPS614308B2 publication Critical patent/JPS614308B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE: To make it possible to perform satisfactory soldering by soaking the printing distributing board which has been made stationary above the solder tank, into solder in order from its one end part, subsequently drawing it up in order from one end part.
CONSTITUTION: When the carrier 12 is stopped directly above the solder tank 16, the cylinder parts 581, 582 are driven, the pistons 581, 572 are moved in the direction as indicated with an arrow, and the driving part 56 is coupled with the carrier 12. Subsequently, the driving part 56 is moved further downward, and the printing distributing board 29 mounted to the carrier 12 is soaked into solder 52 of the solder tank 16. In this case, the pistons 571, 572 carry out different movements, respectively, the distributing board 29 is soaked in order extending over to the other end part from one end part, is drawn up in order from one end part after it has been soaked horizontally. In this case, it is perferable that the first end part is soaked at a high speed and gradually at a low speed as soaking proceeds to the other end part, while in case of drawing up, the first end part is made at a low speed in reverse, and it is changed to a high speed gradually as it proceeds to the other end part.
COPYRIGHT: (C)1980,JPO&Japio
JP11333478A 1978-09-14 1978-09-14 Soldering method of automatic soldering device Granted JPS5540076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11333478A JPS5540076A (en) 1978-09-14 1978-09-14 Soldering method of automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11333478A JPS5540076A (en) 1978-09-14 1978-09-14 Soldering method of automatic soldering device

Publications (2)

Publication Number Publication Date
JPS5540076A true JPS5540076A (en) 1980-03-21
JPS614308B2 JPS614308B2 (en) 1986-02-08

Family

ID=14609600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11333478A Granted JPS5540076A (en) 1978-09-14 1978-09-14 Soldering method of automatic soldering device

Country Status (1)

Country Link
JP (1) JPS5540076A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) * 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) * 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath

Also Published As

Publication number Publication date
JPS614308B2 (en) 1986-02-08

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