JPS57101670A - Etching apparatus - Google Patents

Etching apparatus

Info

Publication number
JPS57101670A
JPS57101670A JP17849380A JP17849380A JPS57101670A JP S57101670 A JPS57101670 A JP S57101670A JP 17849380 A JP17849380 A JP 17849380A JP 17849380 A JP17849380 A JP 17849380A JP S57101670 A JPS57101670 A JP S57101670A
Authority
JP
Japan
Prior art keywords
etching
etching liquid
mask
sump tank
stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17849380A
Other languages
Japanese (ja)
Inventor
Takeshige Obata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17849380A priority Critical patent/JPS57101670A/en
Publication of JPS57101670A publication Critical patent/JPS57101670A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To enable to obtain a mask with high accuracy by providing a jig holding a hard mask and a channel naturally dropping an etching liquid to a part of a recirculation channel of the etching liquid.
CONSTITUTION: An etching apparatus comprises an etching stand 2 naturally dropping an etching liquid, a lower sump tank 4 accumulating the etching liquid provided to a lower part thereof, an upper sump 5 holding the etching liquid provided to an upper part thereof and a pump 6. To the etching stand 2, a mask 1 to be etched is fixed by a mask holding jig 3 so as to face a surface thereof upwardly. The etching liquid is flowed down onto the mask 1 from the upper sump tank 5 to carry out etching and the etching liquid flowed down into the lower sump tank 4 is returned to the upper sump tank 5 by the pump 6. Thereby, uniform etching is carried out. Further, an inclination angle of the etching stand 2 is pref. about 40W50°.
COPYRIGHT: (C)1982,JPO&Japio
JP17849380A 1980-12-17 1980-12-17 Etching apparatus Pending JPS57101670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17849380A JPS57101670A (en) 1980-12-17 1980-12-17 Etching apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17849380A JPS57101670A (en) 1980-12-17 1980-12-17 Etching apparatus

Publications (1)

Publication Number Publication Date
JPS57101670A true JPS57101670A (en) 1982-06-24

Family

ID=16049409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17849380A Pending JPS57101670A (en) 1980-12-17 1980-12-17 Etching apparatus

Country Status (1)

Country Link
JP (1) JPS57101670A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007099029A (en) * 2005-10-03 2007-04-19 Nissan Motor Co Ltd Unit mounting structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007099029A (en) * 2005-10-03 2007-04-19 Nissan Motor Co Ltd Unit mounting structure

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