JPS5623298A - Metallic material made pattern used for electric circuit forming method by plating - Google Patents

Metallic material made pattern used for electric circuit forming method by plating

Info

Publication number
JPS5623298A
JPS5623298A JP9969579A JP9969579A JPS5623298A JP S5623298 A JPS5623298 A JP S5623298A JP 9969579 A JP9969579 A JP 9969579A JP 9969579 A JP9969579 A JP 9969579A JP S5623298 A JPS5623298 A JP S5623298A
Authority
JP
Japan
Prior art keywords
electric circuit
plating
forming method
metallic material
material made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9969579A
Other languages
Japanese (ja)
Other versions
JPS5730915B2 (en
Inventor
Masami Takagi
Shunichi Nakayama
Yoshinori Urakuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9969579A priority Critical patent/JPS5623298A/en
Publication of JPS5623298A publication Critical patent/JPS5623298A/en
Publication of JPS5730915B2 publication Critical patent/JPS5730915B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To achieve insulation coating of homogeneous quality and uniform thickness, at the time of forming electric circuit on an insulation substrate through electroplating, by insulating and coating the metallic pattern from which the part for forming an electric circuit is cut off by polyparaxylene.
CONSTITUTION: An extremely thin conductive metal layer is formed on an insulation substrate and the metal made patterns with insulation coating from which the part for forming the electric circuit is cut off fixed thereon. Thence, the 2nd thin conductive metal layer is formed by electroplating thereon and this is removed to form electric circuit on the insulation substrate. If at this time the metal made pattern is insulated and coated by polyparaxylene, the insulation coating of homogeneous quality and uniform thickness becomes possible.
COPYRIGHT: (C)1981,JPO&Japio
JP9969579A 1979-08-03 1979-08-03 Metallic material made pattern used for electric circuit forming method by plating Granted JPS5623298A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9969579A JPS5623298A (en) 1979-08-03 1979-08-03 Metallic material made pattern used for electric circuit forming method by plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9969579A JPS5623298A (en) 1979-08-03 1979-08-03 Metallic material made pattern used for electric circuit forming method by plating

Publications (2)

Publication Number Publication Date
JPS5623298A true JPS5623298A (en) 1981-03-05
JPS5730915B2 JPS5730915B2 (en) 1982-07-01

Family

ID=14254176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9969579A Granted JPS5623298A (en) 1979-08-03 1979-08-03 Metallic material made pattern used for electric circuit forming method by plating

Country Status (1)

Country Link
JP (1) JPS5623298A (en)

Also Published As

Publication number Publication date
JPS5730915B2 (en) 1982-07-01

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