JPS57207195A - Thick plating method for copper on aluminum racket terminal - Google Patents
Thick plating method for copper on aluminum racket terminalInfo
- Publication number
- JPS57207195A JPS57207195A JP9175581A JP9175581A JPS57207195A JP S57207195 A JPS57207195 A JP S57207195A JP 9175581 A JP9175581 A JP 9175581A JP 9175581 A JP9175581 A JP 9175581A JP S57207195 A JPS57207195 A JP S57207195A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- parts
- thick
- racket
- insulating paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To form thick Cu plating of superior uniform electrodepositablity by forming an insulating paint film on the parts of an Al type metallic racket terminal other than its electrical contact surfaces as a pretreatment, and subjecting this to strike-plating of a Cu type metal then mounting an insulation cover on the insulating paint film parts and plating Cu thickly thereon.
CONSTITUTION: In forming a thick plating layer of Cu on one surface 3 which is an electrical contact part in a racket part 2 of a racket terminal made of Al or an Al alloy, insulating paint is coated on the parts other than the surface 3 and is dried. The surface 3 is applied with strike-plating of Cu or Cu alloy, after which an attachable and detachable insulation cover 4 of soft PVC, silicone rubber or the like having elasticity is put on the parts coated with the insulating paint. This is put in a Cu plating bath and a thick plating layer of Cu is formed by electroplating, whereby the thick Cu plating layer of superior uniform electrodepositability is formed thereon without allowing Cu to deposit on the parts other than the surface 3.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9175581A JPS5843472B2 (en) | 1981-06-15 | 1981-06-15 | How to plate copper thickness on aluminum battledore terminals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9175581A JPS5843472B2 (en) | 1981-06-15 | 1981-06-15 | How to plate copper thickness on aluminum battledore terminals |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57207195A true JPS57207195A (en) | 1982-12-18 |
JPS5843472B2 JPS5843472B2 (en) | 1983-09-27 |
Family
ID=14035350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9175581A Expired JPS5843472B2 (en) | 1981-06-15 | 1981-06-15 | How to plate copper thickness on aluminum battledore terminals |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5843472B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2367255B (en) * | 2000-09-04 | 2003-03-12 | Aerolatte Ltd | Electric whisk |
-
1981
- 1981-06-15 JP JP9175581A patent/JPS5843472B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2367255B (en) * | 2000-09-04 | 2003-03-12 | Aerolatte Ltd | Electric whisk |
Also Published As
Publication number | Publication date |
---|---|
JPS5843472B2 (en) | 1983-09-27 |
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