JPS5621355A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5621355A
JPS5621355A JP9631379A JP9631379A JPS5621355A JP S5621355 A JPS5621355 A JP S5621355A JP 9631379 A JP9631379 A JP 9631379A JP 9631379 A JP9631379 A JP 9631379A JP S5621355 A JPS5621355 A JP S5621355A
Authority
JP
Japan
Prior art keywords
electrode
base
solder
chip
done
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9631379A
Other languages
Japanese (ja)
Inventor
Takashi Kamikawa
Toshio Yao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9631379A priority Critical patent/JPS5621355A/en
Publication of JPS5621355A publication Critical patent/JPS5621355A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE:To obtain a full-wave rectifying circuit with high efficiency by junctioning two diode elements on an electrode base having a terminal rising one end and by taking out an electrode terminal on the element at the other end side wherein a lead is led out in the direction of a base width on the element at one end side and these two components are combined. CONSTITUTION:Diode chips 3a, 3b are arranged on the base section 22 of an L- shaped electrode 21. Soldering thin pieces 5, 6 are provided on the upper and lower surfaces and heat pressure is done to temporarily fix. One end 25 of the L-shaped electrode 24 is bent downwardly and placed on the solder 6 on the chip 3b to face the other end 26 with one end 23 of the electrode 21. One end 28 of an electrode lead 27 is bent downwardly and placed on the solder 6 on the chip 3a to cross the other end with the base 22 at right angles and a hole 27a is provided at a tip. Positioning is made by a jig and high temperature treatment is done for the temporary stopper to fix the chips. The second component 30 is also assembled wit reverse polarity in the same way. After inspections, both components are combined and a full-wave rectifying circuit will be formed. In this composition, defectives will be reduced to improve productivity.
JP9631379A 1979-07-28 1979-07-28 Semiconductor device Pending JPS5621355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9631379A JPS5621355A (en) 1979-07-28 1979-07-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9631379A JPS5621355A (en) 1979-07-28 1979-07-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5621355A true JPS5621355A (en) 1981-02-27

Family

ID=14161529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9631379A Pending JPS5621355A (en) 1979-07-28 1979-07-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5621355A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819042A (en) * 1983-10-31 1989-04-04 Kaufman Lance R Isolated package for multiple semiconductor power components
US5821618A (en) * 1994-08-12 1998-10-13 Siemens Aktiengesellschaft Semiconductor component with insulating housing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819042A (en) * 1983-10-31 1989-04-04 Kaufman Lance R Isolated package for multiple semiconductor power components
US5821618A (en) * 1994-08-12 1998-10-13 Siemens Aktiengesellschaft Semiconductor component with insulating housing

Similar Documents

Publication Publication Date Title
US3972062A (en) Mounting assemblies for a plurality of transistor integrated circuit chips
DE3680267D1 (en) LOCKED CONTACT ELEMENT.
GB1440545A (en) Semiconductor device including a chip bonded to a metal surface
JPS5621355A (en) Semiconductor device
JPS5599731A (en) Method of assembling electronic device and lead frame used for assembly
JPS56133857A (en) Manufacture of hybrid ic
JPS55125637A (en) Production of semiconductor device
JPS629722Y2 (en)
JPS57111054A (en) Semiconductor device
JPS57178387A (en) Indicator for luminescence and its manufacture
JPS5451477A (en) Mounting method of semiconductor chip
JPS56142666A (en) Semiconductor device
JPS5483375A (en) Bonding of flip-chip integrated circuit
JPS5791545A (en) Manufacture of glass sealed semiconductor device
JPS56116646A (en) Semiconductor device
JPS56164562A (en) Power transistor
JPS56111234A (en) Semiconductor integrated circuit device and manufacture thereof
JPS56157051A (en) Manufacture of semiconductor device of lamination type
JPS558025A (en) Electronic circuit device
JPS5791546A (en) Manufacture of glass sealed semiconductor device
JPS55133548A (en) Insulating board for semiconductor element
JPS5685844A (en) Diode composite circuit device
JPS55121656A (en) Manufacture of semiconductor device
JPS55128838A (en) Method of fabricating semiconductor device
JPS6424493A (en) Method for mounting chip component