JPS5619628A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPS5619628A
JPS5619628A JP9474279A JP9474279A JPS5619628A JP S5619628 A JPS5619628 A JP S5619628A JP 9474279 A JP9474279 A JP 9474279A JP 9474279 A JP9474279 A JP 9474279A JP S5619628 A JPS5619628 A JP S5619628A
Authority
JP
Japan
Prior art keywords
strength
purity
semiconductor element
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9474279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222450B2 (ref
Inventor
Shozo Hayashi
Susumu Tomiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK, Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP9474279A priority Critical patent/JPS5619628A/ja
Publication of JPS5619628A publication Critical patent/JPS5619628A/ja
Publication of JPS6222450B2 publication Critical patent/JPS6222450B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
JP9474279A 1979-07-25 1979-07-25 Bonding wire for semiconductor element Granted JPS5619628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9474279A JPS5619628A (en) 1979-07-25 1979-07-25 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9474279A JPS5619628A (en) 1979-07-25 1979-07-25 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5619628A true JPS5619628A (en) 1981-02-24
JPS6222450B2 JPS6222450B2 (ref) 1987-05-18

Family

ID=14118568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9474279A Granted JPS5619628A (en) 1979-07-25 1979-07-25 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5619628A (ref)

Also Published As

Publication number Publication date
JPS6222450B2 (ref) 1987-05-18

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