JPS56162896A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56162896A JPS56162896A JP6698580A JP6698580A JPS56162896A JP S56162896 A JPS56162896 A JP S56162896A JP 6698580 A JP6698580 A JP 6698580A JP 6698580 A JP6698580 A JP 6698580A JP S56162896 A JPS56162896 A JP S56162896A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- layers
- conductive
- ohmic contact
- secure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
Abstract
PURPOSE:To simplify the manufacture of a semiconductor device such as a buried laser in which a conductive layer is ohmically attached to the laminated different conductive type semiconductor layers by forming different materials of the conductive layers for both conductive layers in the semiconductor device. CONSTITUTION:A conductive layer 19 made of Au-Zn alloy or the like is formed by deposition with secure and preferable ohmic contact between the semiconductor layers 11 of a laminated 12 on a laminate 18 laminated on a semi-insulating substrate 1. Then, conductive layers 21, 28, 29 made of Au-Ge-Ni alloy or the like is formed with secure and preferable ohmic contact between the semiconductor layers 2 of the laminate 18. Subsequently, it is heat treated to obtain secure and preferable ohmic contact for the layer 2 of the layer 29, the layer 28 is formed on the layer 21, thereby obtaining secure and preferable ohmic contact between the layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6698580A JPS56162896A (en) | 1980-05-20 | 1980-05-20 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6698580A JPS56162896A (en) | 1980-05-20 | 1980-05-20 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56162896A true JPS56162896A (en) | 1981-12-15 |
Family
ID=13331811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6698580A Pending JPS56162896A (en) | 1980-05-20 | 1980-05-20 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56162896A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58213491A (en) * | 1982-06-07 | 1983-12-12 | Omron Tateisi Electronics Co | Semiconductor laser |
US5346854A (en) * | 1991-11-07 | 1994-09-13 | Goldstar Co., Ltd. | Method of making a semiconductor laser |
-
1980
- 1980-05-20 JP JP6698580A patent/JPS56162896A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58213491A (en) * | 1982-06-07 | 1983-12-12 | Omron Tateisi Electronics Co | Semiconductor laser |
US5346854A (en) * | 1991-11-07 | 1994-09-13 | Goldstar Co., Ltd. | Method of making a semiconductor laser |
US5570385A (en) * | 1991-11-07 | 1996-10-29 | Goldstar Co., Ltd. | Semiconductor laser and method for manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56162896A (en) | Manufacture of semiconductor device | |
JPS5312281A (en) | Semiconductor control rectifying element | |
JPS57116346A (en) | Photoconductive material | |
JPS523383A (en) | Manufacturing method of semiconductor device electrode | |
JPS5323564A (en) | Bump type semiconductor device | |
JPS5636159A (en) | Schottky diode | |
JPS645038A (en) | Semiconductor device | |
JPS5791579A (en) | Semiconductor device | |
JPS5745288A (en) | Thin film photo diode | |
FR2359508A1 (en) | Semiconductor diode with protective substance - which is onto lower surface of trench in PN slice and prevents adhesion of metal | |
JPS52146174A (en) | Susceptor for vapor growth of semiconductor | |
JPS5318960A (en) | Bonding method | |
JPS5612769A (en) | Semiconductor device | |
JPS5313872A (en) | Production of semiconductor device | |
JPS5796548A (en) | Semiconductor device | |
JPS5522882A (en) | Semiconductor device | |
JPS53126871A (en) | Diode | |
JPS6461951A (en) | Manufacture of semiconductor device | |
JPS53116073A (en) | Semiconductor device | |
JPS5541751A (en) | Manufacturing semiconductor device | |
JPS57117280A (en) | Semiconductor device and manufacture thereof | |
JPS57109349A (en) | Face-down bonding method | |
JPS5298478A (en) | Production of buried layer | |
JPS5317286A (en) | Production of semiconductor device | |
JPS53121488A (en) | Wiring forming method for semiconductor element |