JPS56161657A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56161657A
JPS56161657A JP6523480A JP6523480A JPS56161657A JP S56161657 A JPS56161657 A JP S56161657A JP 6523480 A JP6523480 A JP 6523480A JP 6523480 A JP6523480 A JP 6523480A JP S56161657 A JPS56161657 A JP S56161657A
Authority
JP
Japan
Prior art keywords
film
window
face
melting point
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6523480A
Other languages
Japanese (ja)
Inventor
Kazunori Imaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6523480A priority Critical patent/JPS56161657A/en
Publication of JPS56161657A publication Critical patent/JPS56161657A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To form an electrode window with alleviated step by forming a low melting point fiom on a substrate on which an insulating film and a surface stabilized film are formed, smoothing the end face of the window and then etching the overall surface, thereby maintaining high accuracy of a diffused layer. CONSTITUTION:In steps of manufacturing an MOSFET, an ion injection layer 5 is formed, a PSG film 9 is accumulated, a PSG film 10 in which Ge having a melting point lower than the film 9 is doped is coated on the overall surface, and a window 8 is formed at the film 10. Subsequently, it is heat treated at low temperature (-1,000 deg.C), the end face 7 of the window of the film 10 is formed in a smooth shape 7', and source and drain diffused layers 6 are simultaneously formed. Thereafter, the film 10 is all removed, for example, by a dry etching to form a window at the film 9 and the oxidized film 2 of the surface of the substrate, and an electrode window 8' having smooth end face is thus formed. Thus, it can alleviate the step of the window, and since it is not treated at high temperature, its diffusing accuracy can be highly maintained.
JP6523480A 1980-05-19 1980-05-19 Manufacture of semiconductor device Pending JPS56161657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6523480A JPS56161657A (en) 1980-05-19 1980-05-19 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6523480A JPS56161657A (en) 1980-05-19 1980-05-19 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56161657A true JPS56161657A (en) 1981-12-12

Family

ID=13281011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6523480A Pending JPS56161657A (en) 1980-05-19 1980-05-19 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56161657A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5157296A (en) * 1974-11-15 1976-05-19 Tokyo Shibaura Electric Co Handotaisoshino seizohoho
JPS5162673A (en) * 1974-11-27 1976-05-31 Fujitsu Ltd Handotaisochino seizohoho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5157296A (en) * 1974-11-15 1976-05-19 Tokyo Shibaura Electric Co Handotaisoshino seizohoho
JPS5162673A (en) * 1974-11-27 1976-05-31 Fujitsu Ltd Handotaisochino seizohoho

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