JPS56155221A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS56155221A JPS56155221A JP5708880A JP5708880A JPS56155221A JP S56155221 A JPS56155221 A JP S56155221A JP 5708880 A JP5708880 A JP 5708880A JP 5708880 A JP5708880 A JP 5708880A JP S56155221 A JPS56155221 A JP S56155221A
- Authority
- JP
- Japan
- Prior art keywords
- low polymer
- anhydride
- component
- maleic anhydride
- butadiene low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: Title resind composition which can provide, cured products excellent in flexibility, mechanical strength, electrical properties, etc., comprising an epoxy resin and a maleinized butadiene low polymer prepared by adding maleic anhydride to a butadiene low polymer.
CONSTITUTION: The resin composition of the purpose is prepared by mixing (A) an epoxy resin, (B) a maleinized butadiene low polymer prepared by adding 0.1W 1.5mol of maleic anhydride to 100g of a butadiene low polymer, number-average MW 300W5,000, and, if necessary, (C) an acid anhydride, e.g., phthalic anhydride or maleic anhydride. Preferably, said mixing is carried out so that the eq. ratio of the total anhydride groups contained in components B and C to the epoxy groups of component A is 0.1W5, and 0W2,000pts.wt. component C is present with respect to 100pts.wt. component B.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5708880A JPS56155221A (en) | 1980-05-01 | 1980-05-01 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5708880A JPS56155221A (en) | 1980-05-01 | 1980-05-01 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56155221A true JPS56155221A (en) | 1981-12-01 |
JPS6248685B2 JPS6248685B2 (en) | 1987-10-15 |
Family
ID=13045734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5708880A Granted JPS56155221A (en) | 1980-05-01 | 1980-05-01 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56155221A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57205421A (en) * | 1981-05-19 | 1982-12-16 | Hitachi Chem Co Ltd | Epoxy resin curing agent |
JPS6386717A (en) * | 1986-09-30 | 1988-04-18 | Idemitsu Petrochem Co Ltd | Curing agent for epoxy resin |
-
1980
- 1980-05-01 JP JP5708880A patent/JPS56155221A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57205421A (en) * | 1981-05-19 | 1982-12-16 | Hitachi Chem Co Ltd | Epoxy resin curing agent |
JPS6386717A (en) * | 1986-09-30 | 1988-04-18 | Idemitsu Petrochem Co Ltd | Curing agent for epoxy resin |
JPH0534371B2 (en) * | 1986-09-30 | 1993-05-21 | Idemitsu Petrochemical Co |
Also Published As
Publication number | Publication date |
---|---|
JPS6248685B2 (en) | 1987-10-15 |
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