JPS56155221A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS56155221A
JPS56155221A JP5708880A JP5708880A JPS56155221A JP S56155221 A JPS56155221 A JP S56155221A JP 5708880 A JP5708880 A JP 5708880A JP 5708880 A JP5708880 A JP 5708880A JP S56155221 A JPS56155221 A JP S56155221A
Authority
JP
Japan
Prior art keywords
low polymer
anhydride
component
maleic anhydride
butadiene low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5708880A
Other languages
Japanese (ja)
Other versions
JPS6248685B2 (en
Inventor
Hideo Horii
Hajime Hara
Yoshihiko Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Oil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oil Corp filed Critical Nippon Oil Corp
Priority to JP5708880A priority Critical patent/JPS56155221A/en
Publication of JPS56155221A publication Critical patent/JPS56155221A/en
Publication of JPS6248685B2 publication Critical patent/JPS6248685B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: Title resind composition which can provide, cured products excellent in flexibility, mechanical strength, electrical properties, etc., comprising an epoxy resin and a maleinized butadiene low polymer prepared by adding maleic anhydride to a butadiene low polymer.
CONSTITUTION: The resin composition of the purpose is prepared by mixing (A) an epoxy resin, (B) a maleinized butadiene low polymer prepared by adding 0.1W 1.5mol of maleic anhydride to 100g of a butadiene low polymer, number-average MW 300W5,000, and, if necessary, (C) an acid anhydride, e.g., phthalic anhydride or maleic anhydride. Preferably, said mixing is carried out so that the eq. ratio of the total anhydride groups contained in components B and C to the epoxy groups of component A is 0.1W5, and 0W2,000pts.wt. component C is present with respect to 100pts.wt. component B.
COPYRIGHT: (C)1981,JPO&Japio
JP5708880A 1980-05-01 1980-05-01 Thermosetting resin composition Granted JPS56155221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5708880A JPS56155221A (en) 1980-05-01 1980-05-01 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5708880A JPS56155221A (en) 1980-05-01 1980-05-01 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS56155221A true JPS56155221A (en) 1981-12-01
JPS6248685B2 JPS6248685B2 (en) 1987-10-15

Family

ID=13045734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5708880A Granted JPS56155221A (en) 1980-05-01 1980-05-01 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS56155221A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57205421A (en) * 1981-05-19 1982-12-16 Hitachi Chem Co Ltd Epoxy resin curing agent
JPS6386717A (en) * 1986-09-30 1988-04-18 Idemitsu Petrochem Co Ltd Curing agent for epoxy resin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57205421A (en) * 1981-05-19 1982-12-16 Hitachi Chem Co Ltd Epoxy resin curing agent
JPS6386717A (en) * 1986-09-30 1988-04-18 Idemitsu Petrochem Co Ltd Curing agent for epoxy resin
JPH0534371B2 (en) * 1986-09-30 1993-05-21 Idemitsu Petrochemical Co

Also Published As

Publication number Publication date
JPS6248685B2 (en) 1987-10-15

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