JPS56135516A - Epoxy resin composition for laminate - Google Patents

Epoxy resin composition for laminate

Info

Publication number
JPS56135516A
JPS56135516A JP3832580A JP3832580A JPS56135516A JP S56135516 A JPS56135516 A JP S56135516A JP 3832580 A JP3832580 A JP 3832580A JP 3832580 A JP3832580 A JP 3832580A JP S56135516 A JPS56135516 A JP S56135516A
Authority
JP
Japan
Prior art keywords
epoxy resin
carboxylic acid
acid anhydride
groups
polyphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3832580A
Other languages
Japanese (ja)
Inventor
Toshimaro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP3832580A priority Critical patent/JPS56135516A/en
Publication of JPS56135516A publication Critical patent/JPS56135516A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: An epoxy resin composition for laminates having excellent heat resistance, moisture resistance, solvent resistance and workability, prepared by adding a polyphenol to an adduct prepared by prereacting an epoxy resin with a less than eq. amount of a carboxylic acid anhydride.
CONSTITUTION: A polyphenol is added to an adduct prepared by reacting an epoxy resin and a less than eq. amount of a carboxylic acid anhydride. The carboxylic acid anhydride is used in an amount equal to or smaller than the number of eqs. of the epoxy resin. This is a requirement to secure that the anhydride groups and the carboxyl groups can be completely prereacted in the presence of an excess of epoxy groups under conditions not causing gelation. Next, by addition of the polyphenol the residual epoxy groups in the prereacted product between the epoxy resin and the carboxylic acid anhydride are reacted with the phenolic hydroxyl groups to give a fully cured product.
COPYRIGHT: (C)1981,JPO&Japio
JP3832580A 1980-03-26 1980-03-26 Epoxy resin composition for laminate Pending JPS56135516A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3832580A JPS56135516A (en) 1980-03-26 1980-03-26 Epoxy resin composition for laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3832580A JPS56135516A (en) 1980-03-26 1980-03-26 Epoxy resin composition for laminate

Publications (1)

Publication Number Publication Date
JPS56135516A true JPS56135516A (en) 1981-10-23

Family

ID=12522125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3832580A Pending JPS56135516A (en) 1980-03-26 1980-03-26 Epoxy resin composition for laminate

Country Status (1)

Country Link
JP (1) JPS56135516A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920321A (en) * 1982-07-28 1984-02-02 Mitsubishi Petrochem Co Ltd Epoxy resin composition
JPH03172316A (en) * 1989-11-30 1991-07-25 Shin Etsu Chem Co Ltd Light-transmitting epoxy resin composition and photo-semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920321A (en) * 1982-07-28 1984-02-02 Mitsubishi Petrochem Co Ltd Epoxy resin composition
JPH0230329B2 (en) * 1982-07-28 1990-07-05 Mitsubishi Petrochemical Co
JPH03172316A (en) * 1989-11-30 1991-07-25 Shin Etsu Chem Co Ltd Light-transmitting epoxy resin composition and photo-semiconductor device

Similar Documents

Publication Publication Date Title
JPS5611924A (en) Curable resin composition
DE3172531D1 (en) Vinyl ester resin compositions
GB991054A (en) Curable epoxy resin compositions
JPS56135516A (en) Epoxy resin composition for laminate
JPS5465759A (en) Flexible epoxy resin composition
JPS56135515A (en) Epoxy resin composition for laminate
JPS5778416A (en) Thermosetting resin composition
JPS51135999A (en) Epoxy res in composition
JPS56157426A (en) Curable resin composition
JPS57174314A (en) Epoxy resin composition
JPS5634724A (en) Epoxy resin composition
GB1105141A (en) Thermosetting epoxy resin compositions
JPS5414499A (en) Heat resistant resin composition
JPS5649726A (en) Epoxy resin composition having excellent transparency for casting
JPS57198719A (en) Phenolic resin from cashew shell liquid
JPS56127630A (en) Curable resin composition
JPS5698227A (en) Epoxy resin composition
JPS56115363A (en) Photosetting resin composition for electrical insulation
JPS5356609A (en) Preparation of metal-containing composition with ionic bonds andmetal-containing cured resin obtained therefrom
JPS57177026A (en) Manufacture of solvent-free laminated board
JPS5731923A (en) Epoxy resin composition
JPS5565216A (en) Preparation of heat-resistant resin
JPS5565217A (en) Preparation of heat-resistant resin
JPS562317A (en) Curing agent for heat-resistant epoxy resin
JPS5550019A (en) Thermosetting resin composition