JPS56153797A - Method of manufacturing multilayer printed circuit board substrate - Google Patents

Method of manufacturing multilayer printed circuit board substrate

Info

Publication number
JPS56153797A
JPS56153797A JP5699880A JP5699880A JPS56153797A JP S56153797 A JPS56153797 A JP S56153797A JP 5699880 A JP5699880 A JP 5699880A JP 5699880 A JP5699880 A JP 5699880A JP S56153797 A JPS56153797 A JP S56153797A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
multilayer printed
board substrate
manufacturing multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5699880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS648479B2 (enrdf_load_stackoverflow
Inventor
Yorio Iwasaki
Naoki Fukutomi
Akinari Kida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP5699880A priority Critical patent/JPS56153797A/ja
Publication of JPS56153797A publication Critical patent/JPS56153797A/ja
Publication of JPS648479B2 publication Critical patent/JPS648479B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP5699880A 1980-04-28 1980-04-28 Method of manufacturing multilayer printed circuit board substrate Granted JPS56153797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5699880A JPS56153797A (en) 1980-04-28 1980-04-28 Method of manufacturing multilayer printed circuit board substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5699880A JPS56153797A (en) 1980-04-28 1980-04-28 Method of manufacturing multilayer printed circuit board substrate

Publications (2)

Publication Number Publication Date
JPS56153797A true JPS56153797A (en) 1981-11-27
JPS648479B2 JPS648479B2 (enrdf_load_stackoverflow) 1989-02-14

Family

ID=13043150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5699880A Granted JPS56153797A (en) 1980-04-28 1980-04-28 Method of manufacturing multilayer printed circuit board substrate

Country Status (1)

Country Link
JP (1) JPS56153797A (enrdf_load_stackoverflow)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944893A (ja) * 1982-09-08 1984-03-13 日立化成工業株式会社 多層印刷回路板の製造法
JPS61121496A (ja) * 1984-11-19 1986-06-09 東芝ケミカル株式会社 多層印刷配線板
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
JPS61250036A (ja) * 1985-04-30 1986-11-07 Hitachi Ltd 銅と樹脂との接着方法
JPH02306694A (ja) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd 多層配線基板の製造方法
US4997722A (en) * 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
US4997516A (en) * 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
JPH03110889A (ja) * 1989-09-26 1991-05-10 Matsushita Electric Works Ltd 多層積層板の製造方法
EP0469470A1 (en) * 1990-07-30 1992-02-05 Mitsubishi Gas Chemical Company, Inc. Process for producing multilayered printed board
JPH0462047A (ja) * 1990-07-02 1992-02-27 Compeq Mfg Co Ltd 銅と樹脂との結合方法
JPH04304382A (ja) * 1991-04-02 1992-10-27 Compeq Mfg Co Ltd 銅と樹脂との結合方法
JPH05194933A (ja) * 1992-06-26 1993-08-03 Hitachi Ltd 還元剤
JPH06350253A (ja) * 1993-06-11 1994-12-22 Nec Corp 多層印刷配線板の製造方法
US5736065A (en) * 1994-02-02 1998-04-07 Hitachi Chemical Company, Ltd. Chemical reducing solution for copper oxide
US5861076A (en) * 1991-07-19 1999-01-19 Park Electrochemical Corporation Method for making multi-layer circuit boards
JP2000036647A (ja) * 1998-07-21 2000-02-02 Hitachi Chem Co Ltd プリント配線板とその製造法とそのプリント配線板を用いた組立体の製造法
JP2002115078A (ja) * 2000-10-11 2002-04-19 Hitachi Chem Co Ltd 銅の表面処理法
WO2014126193A1 (ja) * 2013-02-14 2014-08-21 三井金属鉱業株式会社 表面処理銅箔及び表面処理銅箔を用いて得られる銅張積層板
WO2015151935A1 (ja) * 2014-03-31 2015-10-08 三井金属鉱業株式会社 キャリア箔付銅箔、銅張積層板及びプリント配線板
WO2015178455A1 (ja) * 2014-05-21 2015-11-26 三井金属鉱業株式会社 透明樹脂基材用銅箔及び微細銅配線付透明樹脂基材
JP2022009114A (ja) * 2019-02-26 2022-01-14 ベジ 佐々木 基板、電子部品及び実装装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2643199A (en) * 1945-12-18 1953-06-23 Hersch Paul Process of forming a layer of metallic copper on copper oxide
GB1015263A (en) * 1962-02-13 1965-12-31 Rothschild Nominees Ltd Improvements relating to the production of copper-clad laminates
JPS5276679A (en) * 1975-12-22 1977-06-28 Hitachi Ltd Method of producing multiilayer printed circuit board
JPS5635497A (en) * 1979-08-30 1981-04-08 Murata Manufacturing Co Method of improving adherence of copper film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2643199A (en) * 1945-12-18 1953-06-23 Hersch Paul Process of forming a layer of metallic copper on copper oxide
GB1015263A (en) * 1962-02-13 1965-12-31 Rothschild Nominees Ltd Improvements relating to the production of copper-clad laminates
JPS5276679A (en) * 1975-12-22 1977-06-28 Hitachi Ltd Method of producing multiilayer printed circuit board
JPS5635497A (en) * 1979-08-30 1981-04-08 Murata Manufacturing Co Method of improving adherence of copper film

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944893A (ja) * 1982-09-08 1984-03-13 日立化成工業株式会社 多層印刷回路板の製造法
JPS61121496A (ja) * 1984-11-19 1986-06-09 東芝ケミカル株式会社 多層印刷配線板
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
JPS61250036A (ja) * 1985-04-30 1986-11-07 Hitachi Ltd 銅と樹脂との接着方法
JPH02306694A (ja) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd 多層配線基板の製造方法
US4997516A (en) * 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
US4997722A (en) * 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
JPH03110889A (ja) * 1989-09-26 1991-05-10 Matsushita Electric Works Ltd 多層積層板の製造方法
JPH0462047A (ja) * 1990-07-02 1992-02-27 Compeq Mfg Co Ltd 銅と樹脂との結合方法
EP0469470A1 (en) * 1990-07-30 1992-02-05 Mitsubishi Gas Chemical Company, Inc. Process for producing multilayered printed board
JPH04304382A (ja) * 1991-04-02 1992-10-27 Compeq Mfg Co Ltd 銅と樹脂との結合方法
US5861076A (en) * 1991-07-19 1999-01-19 Park Electrochemical Corporation Method for making multi-layer circuit boards
JPH05194933A (ja) * 1992-06-26 1993-08-03 Hitachi Ltd 還元剤
JPH06350253A (ja) * 1993-06-11 1994-12-22 Nec Corp 多層印刷配線板の製造方法
US5736065A (en) * 1994-02-02 1998-04-07 Hitachi Chemical Company, Ltd. Chemical reducing solution for copper oxide
JP2000036647A (ja) * 1998-07-21 2000-02-02 Hitachi Chem Co Ltd プリント配線板とその製造法とそのプリント配線板を用いた組立体の製造法
JP2002115078A (ja) * 2000-10-11 2002-04-19 Hitachi Chem Co Ltd 銅の表面処理法
WO2014126193A1 (ja) * 2013-02-14 2014-08-21 三井金属鉱業株式会社 表面処理銅箔及び表面処理銅箔を用いて得られる銅張積層板
CN105102678A (zh) * 2013-02-14 2015-11-25 三井金属矿业株式会社 表面处理铜箔及用表面处理铜箔得到的覆铜层压板
WO2015151935A1 (ja) * 2014-03-31 2015-10-08 三井金属鉱業株式会社 キャリア箔付銅箔、銅張積層板及びプリント配線板
KR20160095178A (ko) * 2014-03-31 2016-08-10 미쓰이금속광업주식회사 캐리어박이 구비된 구리박, 구리 클래드 적층판 및 프린트 배선판
JPWO2015151935A1 (ja) * 2014-03-31 2017-04-13 三井金属鉱業株式会社 キャリア箔付銅箔、銅張積層板及びプリント配線板の製造方法
WO2015178455A1 (ja) * 2014-05-21 2015-11-26 三井金属鉱業株式会社 透明樹脂基材用銅箔及び微細銅配線付透明樹脂基材
JP2022009114A (ja) * 2019-02-26 2022-01-14 ベジ 佐々木 基板、電子部品及び実装装置

Also Published As

Publication number Publication date
JPS648479B2 (enrdf_load_stackoverflow) 1989-02-14

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