JPS56146264A - Carrier for equipment of chip - Google Patents
Carrier for equipment of chipInfo
- Publication number
- JPS56146264A JPS56146264A JP5115480A JP5115480A JPS56146264A JP S56146264 A JPS56146264 A JP S56146264A JP 5115480 A JP5115480 A JP 5115480A JP 5115480 A JP5115480 A JP 5115480A JP S56146264 A JPS56146264 A JP S56146264A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- equipping
- conductors
- face
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 abstract 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5115480A JPS56146264A (en) | 1980-04-14 | 1980-04-14 | Carrier for equipment of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5115480A JPS56146264A (en) | 1980-04-14 | 1980-04-14 | Carrier for equipment of chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56146264A true JPS56146264A (en) | 1981-11-13 |
| JPS6243539B2 JPS6243539B2 (enrdf_load_stackoverflow) | 1987-09-14 |
Family
ID=12878897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5115480A Granted JPS56146264A (en) | 1980-04-14 | 1980-04-14 | Carrier for equipment of chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56146264A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998047326A1 (en) * | 1997-04-16 | 1998-10-22 | Shinko Electric Industries Co., Ltd. | Wiring board having vias |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334444U (enrdf_load_stackoverflow) * | 1989-08-11 | 1991-04-04 |
-
1980
- 1980-04-14 JP JP5115480A patent/JPS56146264A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998047326A1 (en) * | 1997-04-16 | 1998-10-22 | Shinko Electric Industries Co., Ltd. | Wiring board having vias |
| US6271483B1 (en) | 1997-04-16 | 2001-08-07 | Shinko Electric Industries Co., Ltd | Wiring board having vias |
| EP0926931A4 (en) * | 1997-04-16 | 2006-12-06 | Shinko Electric Ind Co | CONDUCTOR PLATE WITH CONTACT |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6243539B2 (enrdf_load_stackoverflow) | 1987-09-14 |
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