JPS56146262A - Manufacture of lead wire having metal of high melting point - Google Patents

Manufacture of lead wire having metal of high melting point

Info

Publication number
JPS56146262A
JPS56146262A JP4864780A JP4864780A JPS56146262A JP S56146262 A JPS56146262 A JP S56146262A JP 4864780 A JP4864780 A JP 4864780A JP 4864780 A JP4864780 A JP 4864780A JP S56146262 A JPS56146262 A JP S56146262A
Authority
JP
Japan
Prior art keywords
lead wire
melting point
high melting
metal lead
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4864780A
Other languages
English (en)
Inventor
Hiroyuki Aono
Hirohide Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4864780A priority Critical patent/JPS56146262A/ja
Publication of JPS56146262A publication Critical patent/JPS56146262A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4875—Connection or disconnection of other leads to or from bases or plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Arc Welding In General (AREA)
JP4864780A 1980-04-15 1980-04-15 Manufacture of lead wire having metal of high melting point Pending JPS56146262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4864780A JPS56146262A (en) 1980-04-15 1980-04-15 Manufacture of lead wire having metal of high melting point

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4864780A JPS56146262A (en) 1980-04-15 1980-04-15 Manufacture of lead wire having metal of high melting point

Publications (1)

Publication Number Publication Date
JPS56146262A true JPS56146262A (en) 1981-11-13

Family

ID=12809144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4864780A Pending JPS56146262A (en) 1980-04-15 1980-04-15 Manufacture of lead wire having metal of high melting point

Country Status (1)

Country Link
JP (1) JPS56146262A (ja)

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