GB1098534A - Improvements in or relating to the manufacture of electrical components - Google Patents

Improvements in or relating to the manufacture of electrical components

Info

Publication number
GB1098534A
GB1098534A GB39556/66A GB3955666A GB1098534A GB 1098534 A GB1098534 A GB 1098534A GB 39556/66 A GB39556/66 A GB 39556/66A GB 3955666 A GB3955666 A GB 3955666A GB 1098534 A GB1098534 A GB 1098534A
Authority
GB
United Kingdom
Prior art keywords
leads
electrical components
sept
attaching
flames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB39556/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1098534A publication Critical patent/GB1098534A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45647—Copper (Cu) as principal constituent
    • H—ELECTRICITY
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01031—Gallium [Ga]
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    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
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    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

1,098,534. Soldering. SIEMENS A.G. Sept. 5, 1966 [Sept. 6, 1965], No. 39556/66. Heading B3R. [Also in Division H1] In a process for attaching a semiconductor device to its current supply leads, the base electrode 1 of the device is first welded to lead 11 and the remaining leads 12, 13 are then bent into contact with the emitter and collector electrodes 2, 3 and joined thereto using hydrogen flames. The electrodes 2, 3 are made of indium-gallium or indiumgallium-aluminium alloy and the leads of copper-sheathed wire which may be coated with gold. The flames employed preferably have a length of between 1 and 5 cm. and the joining is performed in the reducing zone at a temperature of about 200‹ C. when the indium alloy melts and flows over the leads 12, 13, the duration of the heating being 0À3 to 0À5 seconds. The invention may be used for attaching leads to other electrical components, e.g. the grids in electron tubes.
GB39556/66A 1965-09-06 1966-09-05 Improvements in or relating to the manufacture of electrical components Expired GB1098534A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0099263 1965-09-06

Publications (1)

Publication Number Publication Date
GB1098534A true GB1098534A (en) 1968-01-10

Family

ID=7522100

Family Applications (1)

Application Number Title Priority Date Filing Date
GB39556/66A Expired GB1098534A (en) 1965-09-06 1966-09-05 Improvements in or relating to the manufacture of electrical components

Country Status (3)

Country Link
DE (1) DE1514561C3 (en)
GB (1) GB1098534A (en)
NL (1) NL6610877A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2511210C3 (en) * 1975-03-14 1980-03-06 Brown, Boveri & Cie Ag, 6800 Mannheim Method and device for dip soldering of semiconductor components
DE2923440A1 (en) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche METHOD FOR FIXING AND / OR ELECTRICALLY CONNECTING SEMICONDUCTOR BODIES AND / OR THEIR ELECTRICALLY CONDUCTING METAL PARTS
DE10335111B4 (en) 2003-07-31 2006-12-28 Infineon Technologies Ag Assembly method for a semiconductor device

Also Published As

Publication number Publication date
DE1514561A1 (en) 1969-06-26
DE1514561C3 (en) 1975-10-30
DE1514561B2 (en) 1975-03-27
NL6610877A (en) 1967-03-07

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