JPS5613744A - Cutting method for wafer - Google Patents

Cutting method for wafer

Info

Publication number
JPS5613744A
JPS5613744A JP8898179A JP8898179A JPS5613744A JP S5613744 A JPS5613744 A JP S5613744A JP 8898179 A JP8898179 A JP 8898179A JP 8898179 A JP8898179 A JP 8898179A JP S5613744 A JPS5613744 A JP S5613744A
Authority
JP
Japan
Prior art keywords
chips
wafer
sheet
tweezers
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8898179A
Other languages
Japanese (ja)
Inventor
Niwaji Majima
Akira Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8898179A priority Critical patent/JPS5613744A/en
Publication of JPS5613744A publication Critical patent/JPS5613744A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To cut a wafer safely and highly reliable by a method wherein a solvent noxious for the human body, such as an organic solvent, etc. is not used, and a process which holds chips by tweezers is decreased. CONSTITUTION:A wafer 3 is placed on a heat plate 1 through gauze, directing a crystal grown film to a lower portion, and a vinyl sheet 4 coated with a plastic material is let fall. The sheet 4 is placed on a base 5 and fixed, and the wafer is completely cut by a diamond edge 6. When the sheet 7 is set to a base 7, end edges are fixed and the base 7 is lifted, chips 3' are mutually parted. The end edges of the sheet 4 are fixed by stoppers 9, and the chips are rubbed and washed by a bar 10 to whose nose cotton, to which a neutral cheaner is permeated, is fitted. After each chip is washed by water, it is exfoliated by tweezers 11, etc. Since voids are formed among mutual chips, the tips of the tweezers do not damage the end surfaces of the chips, and fragments do not adhere to the surfaces of the chips. This constitution can extract the chips in excellent yield for a short time in extremely few processes.
JP8898179A 1979-07-13 1979-07-13 Cutting method for wafer Pending JPS5613744A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8898179A JPS5613744A (en) 1979-07-13 1979-07-13 Cutting method for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8898179A JPS5613744A (en) 1979-07-13 1979-07-13 Cutting method for wafer

Publications (1)

Publication Number Publication Date
JPS5613744A true JPS5613744A (en) 1981-02-10

Family

ID=13957970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8898179A Pending JPS5613744A (en) 1979-07-13 1979-07-13 Cutting method for wafer

Country Status (1)

Country Link
JP (1) JPS5613744A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS451949Y1 (en) * 1969-02-19 1970-01-27
JPS4979684A (en) * 1972-12-07 1974-08-01
JPS5216163A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Waste removal method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS451949Y1 (en) * 1969-02-19 1970-01-27
JPS4979684A (en) * 1972-12-07 1974-08-01
JPS5216163A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Waste removal method

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