JPS56135955A - Film carrier - Google Patents

Film carrier

Info

Publication number
JPS56135955A
JPS56135955A JP3894680A JP3894680A JPS56135955A JP S56135955 A JPS56135955 A JP S56135955A JP 3894680 A JP3894680 A JP 3894680A JP 3894680 A JP3894680 A JP 3894680A JP S56135955 A JPS56135955 A JP S56135955A
Authority
JP
Japan
Prior art keywords
lead
semiconductor element
cut
window
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3894680A
Other languages
Japanese (ja)
Other versions
JPS6217857B2 (en
Inventor
Naohiko Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3894680A priority Critical patent/JPS56135955A/en
Publication of JPS56135955A publication Critical patent/JPS56135955A/en
Publication of JPS6217857B2 publication Critical patent/JPS6217857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To enhance the reliability of connection of an element by a method wherein a lead having a cut-out in the center thereof is made to bestride over a window for a semiconductor element device provided in a film, the semiconductor element is pressed on a lead terminal for connection and the lead is cut simultaneously. CONSTITUTION:The lead 4 with Sn plating and Cu leaf is arranged in the central part of a polyimide film 1 with a number of sprocket holes 2 at both end parts thereof, being made to bestriding the window 3 wherein the semiconductor element is fitted. In the central part of the bridging part of the lead the cut part 4a is made so that it can be cut with ease. When the Au bump of the semiconductor device is matched in position with a part projected from the window and pressed thereon by heating by means of a bonding tool, a tape is broken at the cut part and simultaneously the semiconductor element is bonded to the lead terminal. By this constitution, the reliability of connection of the lead terminal to the semiconductor element is increased.
JP3894680A 1980-03-28 1980-03-28 Film carrier Granted JPS56135955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3894680A JPS56135955A (en) 1980-03-28 1980-03-28 Film carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3894680A JPS56135955A (en) 1980-03-28 1980-03-28 Film carrier

Publications (2)

Publication Number Publication Date
JPS56135955A true JPS56135955A (en) 1981-10-23
JPS6217857B2 JPS6217857B2 (en) 1987-04-20

Family

ID=12539369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3894680A Granted JPS56135955A (en) 1980-03-28 1980-03-28 Film carrier

Country Status (1)

Country Link
JP (1) JPS56135955A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241754A (en) * 1990-02-20 1991-10-28 Matsushita Electric Ind Co Ltd Film carrier package
JP2008172198A (en) * 2006-12-14 2008-07-24 Hitachi Cable Ltd Tape carrier for semiconductor device and manufacturing method thereof
JP2010272759A (en) * 2009-05-22 2010-12-02 Renesas Electronics Corp Tape carrier package, individual component for tape carrier package, and method of manufacturing tape carrier package and individual component for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241754A (en) * 1990-02-20 1991-10-28 Matsushita Electric Ind Co Ltd Film carrier package
JP2008172198A (en) * 2006-12-14 2008-07-24 Hitachi Cable Ltd Tape carrier for semiconductor device and manufacturing method thereof
JP2010272759A (en) * 2009-05-22 2010-12-02 Renesas Electronics Corp Tape carrier package, individual component for tape carrier package, and method of manufacturing tape carrier package and individual component for the same

Also Published As

Publication number Publication date
JPS6217857B2 (en) 1987-04-20

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