JPH03241754A - Film carrier package - Google Patents

Abstract

PURPOSE:To contrive to improve the packaging density of electronics by constituting a connection terminal to an external printed board through collecting outer leads at one side of a film carrier. CONSTITUTION:An inner lead 3 and wiring conductor 5 provided at a film carrier tape 2 are arranged toward the inside of the film carrier tape 2 overlapping a semiconductor chip 1 and an outer lead 4 is led out to the outside from one side of the film carrier tape 2 to constitute a single-in-line shape. Therefore, the wiring conductor 5 can be constituted within an area formed by the semiconductor chip 1 and it is sufficient that only the outer lead 4 at the time of mounting the film carrier package on the printed board 7 is put out from the outside dimension of the semiconductor chip 1. Thus, it is possible to contrive to improve a packaging density.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a film carrier package for semiconductor chips used in electronic equipment.

BACKGROUND OF THE INVENTION In recent years, packaging systems using film carriers have been widely used as a means of packaging semiconductor chips.

Below is the third part about conventional film carrier packages.
This will be explained with reference to the figures and FIG.

In the figure, 1 is a semiconductor chip, 2 is a film carrier tape, and 3 is a lead (
Hereinafter referred to as the inner lead. ), 4 is a terminal lead (hereinafter referred to as an outer lead) connected to a terminal of a printed circuit board to be described later, 6 is a wiring conductor on the film carrier tape 2, 6 is a gold bump, and 7 is a printed circuit board.

In the above configuration, the electrodes of the semiconductor chip 1 are connected to the inner leads 3 of the film carrier tape 2 via the gold bumps 6. Furthermore, the wiring conductor 6 on the film carrier tape 2 is connected to the printed circuit board 7 at the outer lead 4 part.
connected to. The other electrodes of the semiconductor chip 1 are similarly connected to the inner leads 3 via the gold bumps 6, and are mounted on the printed circuit board 7 via the wiring conductors 6 and the outer leads 4.

Problem to be Solved by the Invention 3.However, in the conventional configuration as described above, each electrode of the semiconductor chip 1 is connected to the inner lead 3 and the wiring conductor 5.
Since the wiring is extended to the outside of the semiconductor chip 1 by the film carrier tape 2 consisting of the outer leads 4 and 4, the area including the semiconductor chip 1 and the film carrier tape 2 becomes large, and the packaging density is lower than that of conventionally used. This is almost the same as the conventional plastic package, and has the problem that the packaging density cannot be increased, and the area of the film carrier tape 2 is large9, resulting in high cost.

In addition, many semiconductor chips require a burn-in process (high temperature storage) for quality assurance, and in the conventional film carrier package described above, the outer leads 4 are provided in multiple directions, making the socket used for burn-in complicated. Not only does this increase the cost of the socket, but it also has the disadvantage that it is difficult to align the outer leads 4 of the film carrier package with the terminals of the socket.

The present invention solves the above problems and aims to provide an excellent film carrier package that can significantly reduce costs.

Means for Solving the Problems In order to achieve the above object, the present invention is composed of a semiconductor chip and a film carrier tape having inner leads and outer leads on the periphery, and the wiring conductor of the film carrier tape is connected to the semiconductor chip. The wires are wired to the film carrier tape in a plane that overlaps with the outer lead, and the outer lead is drawn out from one side of the film carrier tape.

Effects According to the present invention, when the film carrier package is mounted on a printed circuit board, only the outer lead portion is exposed from the outside of the semiconductor chip, so that the outside dimensions of the film carrier package can be almost the same as the outside dimensions of the semiconductor chip. 6 x 7' allows the same size and significantly improves the packaging density of electronic devices, and also reduces film cost because the film carrier tape can also be made smaller.

EXAMPLE Below, regarding one embodiment of the present invention, parts that are the same as those in FIGS. 1 and 2 as well as FIGS. 3 and 4 will be given the same reference numerals, detailed explanations will be omitted, and differences will be explained.

The film carrier tape 2 includes an inner lead 3, a wiring conductor 6, and an outer lead 4, but the difference from the conventional one is that the wiring conductor 5 continuous to the inner lead 3 overlaps the semiconductor chip 1 inside the film carrier tape 2. After being gathered on one side of the film carrier tape 2, the film carrier tape 2 is formed continuously on the outer lead 4, and when this film carrier tape 2 is mounted on the printed circuit board 7, The outer lead 4 is connected to a terminal 8 of a printed circuit board 7.

As described above, according to the above embodiment, the inner leads 3 and the wiring conductors 6 provided on the film carrier tape 2 overlap with the semiconductor chip 1 in the film 6 base.

The outer leads 4 are disposed toward the inside of the carrier tape 2, and are led out from one side of the film carrier tape 2 to form a single in-line shape. The wiring conductor 5 can be configured, and the film carrier package can be attached to the printed circuit board 7.
When mounting on the semiconductor chip 1, only the outer leads 4 are connected to the semiconductor chip 1.
The outer dimensions of the film carrier package can be made almost the same as the size of the semiconductor chip 1, and the packaging density can be significantly improved.

Effects of the Invention As is clear from the above embodiments, according to the present invention, the wiring conductor of the film carrier tape is routed toward the inside of the film carrier tape overlapping the semiconductor chip, and the outer leads are gathered on one side of the film carrier. By forming connection terminals to an external printed circuit board, the size of the film carrier package can be made almost the same as the size of the semiconductor chip, and the area of the printed circuit board can be used extremely effectively.

Since the outer leads are gathered on one side of the film carrier tape, a single-in-line shape can be easily formed, and the structure of the socket for burn-in, which is usually performed in the manufacture of electronic devices using semiconductor devices, is simple. This makes it extremely easy to align the outer leads and socket terminals, and when mounting on a printed circuit board, it also makes it easy to align the outer leads and the terminals on the printed circuit board, providing an excellent film carrier package. can.

[Brief explanation of drawings]

FIG. 1 is a bottom view of a film carrier package according to an embodiment of the present invention, FIG. 2 is a sectional view of the film carrier package mounted on a printed circuit board, and FIG. 3 is a bottom view of a conventional film carrier package. FIG. 4 is a sectional view of the film carrier package mounted on a printed circuit board. 1...Semiconductor chip, 2...Film carrier tape, 3...Lead (inner lead) connected to semiconductor chip, 4...Connected to printed circuit board terminal lead (outer lead), 6...
...Wiring conductor, 7...Printed circuit board, 8.
...Terminal.

Claims (1)

[Claims] It is composed of a semiconductor chip and a film carrier tape provided with a wiring conductor having leads connected to electrodes of the semiconductor chip and terminal leads connected to terminals of a printed circuit board, and the wiring conductor of the film carrier tape is connected to the semiconductor chip. A film carrier package in which a lead is wired to the film carrier tape in a plane that overlaps with the film carrier tape, and a lead connected to a terminal of the printed circuit board is drawn out from one side of the film carrier tape.