JPS56135947A - Highly heat-conductive radiating substrate - Google Patents

Highly heat-conductive radiating substrate

Info

Publication number
JPS56135947A
JPS56135947A JP3978780A JP3978780A JPS56135947A JP S56135947 A JPS56135947 A JP S56135947A JP 3978780 A JP3978780 A JP 3978780A JP 3978780 A JP3978780 A JP 3978780A JP S56135947 A JPS56135947 A JP S56135947A
Authority
JP
Japan
Prior art keywords
radiating substrate
boron nitride
substrate
flame spraying
highly heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3978780A
Other languages
Japanese (ja)
Inventor
Masashi Hasegawa
Masaji Ishii
Masahiko Nakajima
Shinsei Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP3978780A priority Critical patent/JPS56135947A/en
Publication of JPS56135947A publication Critical patent/JPS56135947A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain the highly heat-conductive radiating substrate having large weld strength and heat conductivity by providing a metal coating through linear explosive flame spraying of metal or alloy on a substrate whose main constituent is boron nitride having graphitization index of 20 or less and whose porosity is 30% or below. CONSTITUTION:By using a metal wire such as a wire of Mo, Ni, Mo-Ni alloy as a flame spraying material, the linear explosive flame spraying is applied on to the substrate whose content of boron nitride is 50wt%, which contains aluminum oxide and aluminum nitride, etc. as subconstituents and whose main constituent is boron nitride having graphitization index of 20 or less and the porosity of 30% or below, and thereby an insulated radiating substrate whereon metal coating is applied is prepared. By this method, the insulated radiating substrate having a metallized layer with large weld strength and being excellent in heat conductivity can be manufactured.
JP3978780A 1980-03-28 1980-03-28 Highly heat-conductive radiating substrate Pending JPS56135947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3978780A JPS56135947A (en) 1980-03-28 1980-03-28 Highly heat-conductive radiating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3978780A JPS56135947A (en) 1980-03-28 1980-03-28 Highly heat-conductive radiating substrate

Publications (1)

Publication Number Publication Date
JPS56135947A true JPS56135947A (en) 1981-10-23

Family

ID=12562646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3978780A Pending JPS56135947A (en) 1980-03-28 1980-03-28 Highly heat-conductive radiating substrate

Country Status (1)

Country Link
JP (1) JPS56135947A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701771B4 (en) * 1996-01-24 2012-12-06 Denki Kagaku Kogyo K.K. Method for producing hexagonal boron nitride powder
CN110872677A (en) * 2019-12-05 2020-03-10 北京矿冶科技集团有限公司 Low-burning-loss abradable coating material and application thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701771B4 (en) * 1996-01-24 2012-12-06 Denki Kagaku Kogyo K.K. Method for producing hexagonal boron nitride powder
CN110872677A (en) * 2019-12-05 2020-03-10 北京矿冶科技集团有限公司 Low-burning-loss abradable coating material and application thereof

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