JPS56133455A - Method for reducing amount of chemical copper plating solution - Google Patents

Method for reducing amount of chemical copper plating solution

Info

Publication number
JPS56133455A
JPS56133455A JP3625780A JP3625780A JPS56133455A JP S56133455 A JPS56133455 A JP S56133455A JP 3625780 A JP3625780 A JP 3625780A JP 3625780 A JP3625780 A JP 3625780A JP S56133455 A JPS56133455 A JP S56133455A
Authority
JP
Japan
Prior art keywords
soln
tank
copper plating
chemical copper
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3625780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6411715B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Kikuchi
Hitoshi Oka
Ataru Yokono
Haruo Suzuki
Toyofusa Yoshimura
Akira Matsuo
Osamu Miyazawa
Isamu Tanaka
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3625780A priority Critical patent/JPS56133455A/ja
Publication of JPS56133455A publication Critical patent/JPS56133455A/ja
Publication of JPS6411715B2 publication Critical patent/JPS6411715B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP3625780A 1980-03-24 1980-03-24 Method for reducing amount of chemical copper plating solution Granted JPS56133455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3625780A JPS56133455A (en) 1980-03-24 1980-03-24 Method for reducing amount of chemical copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3625780A JPS56133455A (en) 1980-03-24 1980-03-24 Method for reducing amount of chemical copper plating solution

Publications (2)

Publication Number Publication Date
JPS56133455A true JPS56133455A (en) 1981-10-19
JPS6411715B2 JPS6411715B2 (enrdf_load_stackoverflow) 1989-02-27

Family

ID=12464714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3625780A Granted JPS56133455A (en) 1980-03-24 1980-03-24 Method for reducing amount of chemical copper plating solution

Country Status (1)

Country Link
JP (1) JPS56133455A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306471A (ja) * 1991-05-17 1993-11-19 Hitachi Kasei Techno Plant Kk 無電解銅めっき液の生成方法及び生成装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120629A (ja) * 1984-07-09 1986-01-29 Hitachi Ltd バ−リング加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120629A (ja) * 1984-07-09 1986-01-29 Hitachi Ltd バ−リング加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306471A (ja) * 1991-05-17 1993-11-19 Hitachi Kasei Techno Plant Kk 無電解銅めっき液の生成方法及び生成装置

Also Published As

Publication number Publication date
JPS6411715B2 (enrdf_load_stackoverflow) 1989-02-27

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