JPS56130955A - Cooler for semiconductor element - Google Patents

Cooler for semiconductor element

Info

Publication number
JPS56130955A
JPS56130955A JP3335580A JP3335580A JPS56130955A JP S56130955 A JPS56130955 A JP S56130955A JP 3335580 A JP3335580 A JP 3335580A JP 3335580 A JP3335580 A JP 3335580A JP S56130955 A JPS56130955 A JP S56130955A
Authority
JP
Japan
Prior art keywords
pellet
container
cooling
refrigerant
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3335580A
Other languages
Japanese (ja)
Inventor
Kenji Kijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3335580A priority Critical patent/JPS56130955A/en
Publication of JPS56130955A publication Critical patent/JPS56130955A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the cooling efficiency of the cooler for a semiconductor device and the capacity of a current flowing through the device by interposing a pellet between conductive cooling fins, dipping it directly in the refrigerant in a container and cooling it with the evaporation heat of the refrigerant. CONSTITUTION:The parts of the post surfaces 2 at both sides of a container 10 are pressed in contact to bring a pellet 1, an insulating spacer 2 and cooling fins 5 into contact therewith. A flexible unit 4 is provided as a buffer unit so that unreasonable force is not applied to the container 10 in this case. When the pellet 1 is energized via a terminal 9 and a cooling fin 5, the refrigerant 8 is boiled by the heat transferred from the pellet 1 to the cooling fins 5, and removed as an evaporation heat therefrom. The evaporated refrigerant is conveyed from an evaporation tube 6 to a condenser at the top, then liquefied, and returned to the container 10 via a liquid tube 7. Since the conduction and contact heat resistance between the pellet and the element pressing unit of the conventional one can be eliminated, it can increase the cooling efficiency of the cooler and the capacity of a current, and reduce the size of the element.
JP3335580A 1980-03-18 1980-03-18 Cooler for semiconductor element Pending JPS56130955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3335580A JPS56130955A (en) 1980-03-18 1980-03-18 Cooler for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3335580A JPS56130955A (en) 1980-03-18 1980-03-18 Cooler for semiconductor element

Publications (1)

Publication Number Publication Date
JPS56130955A true JPS56130955A (en) 1981-10-14

Family

ID=12384266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3335580A Pending JPS56130955A (en) 1980-03-18 1980-03-18 Cooler for semiconductor element

Country Status (1)

Country Link
JP (1) JPS56130955A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026215A (en) * 2000-06-30 2002-01-25 Denso Corp Cooling fluid cooling type semiconductor device
EP2693473A1 (en) * 2012-08-03 2014-02-05 GE Energy Power Conversion Technology Ltd Electronic semiconductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such a device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026215A (en) * 2000-06-30 2002-01-25 Denso Corp Cooling fluid cooling type semiconductor device
EP2693473A1 (en) * 2012-08-03 2014-02-05 GE Energy Power Conversion Technology Ltd Electronic semiconductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such a device
FR2994333A1 (en) * 2012-08-03 2014-02-07 Ge Energy Power Conversion Technology Ltd SEMICONDUCTOR ELECTRONIC DEVICE FOR MOUNTING IN A PRESSED STACK ASSEMBLY AND PRESSED STACK ASSEMBLY COMPRISING SUCH A DEVICE
US9093426B2 (en) 2012-08-03 2015-07-28 Ge Energy Power Conversion Technology Ltd. Electronic semi-conductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such device

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