JPS5745265A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5745265A
JPS5745265A JP12134880A JP12134880A JPS5745265A JP S5745265 A JPS5745265 A JP S5745265A JP 12134880 A JP12134880 A JP 12134880A JP 12134880 A JP12134880 A JP 12134880A JP S5745265 A JPS5745265 A JP S5745265A
Authority
JP
Japan
Prior art keywords
semiconductor stack
evaporator
semiconductor
condenser
communicating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12134880A
Other languages
Japanese (ja)
Other versions
JPS6137793B2 (en
Inventor
Haruo Tetsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12134880A priority Critical patent/JPS5745265A/en
Publication of JPS5745265A publication Critical patent/JPS5745265A/en
Publication of JPS6137793B2 publication Critical patent/JPS6137793B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce mounting areas by disposing semiconductor stacks divides so as to be stacked up and down in the boiling cooling type semiconductor device. CONSTITUTION:The second semiconductor stack 3B is arranged to a lower section of the first semiconductor stack 3A, and a condenser 2 is mounted to an upper section of the first semiconductor stack 3A. The first heat transport pipe 5A communicating an evaporator 4 and the condenser 2 of the first semiconductor stack 3A and the second heat transfer pipe 5B communicating the evaporator 4 of the first semiconductor stack 3A and an evaporator 4 of the second semiconductor stack 3B are disposed. The first and second heat transfer pipes 5A, 5B are composed of insulating pipes 7 and a bellows 6. The terminals 14 of the evaporators 4 and electrical members 8A, 8B are connected by conductors 9.
JP12134880A 1980-09-01 1980-09-01 Semiconductor device Granted JPS5745265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12134880A JPS5745265A (en) 1980-09-01 1980-09-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12134880A JPS5745265A (en) 1980-09-01 1980-09-01 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5745265A true JPS5745265A (en) 1982-03-15
JPS6137793B2 JPS6137793B2 (en) 1986-08-26

Family

ID=14809044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12134880A Granted JPS5745265A (en) 1980-09-01 1980-09-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745265A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0630741A (en) * 1992-03-19 1994-02-08 Hisashi Nagatsuma Edible container and snack food

Also Published As

Publication number Publication date
JPS6137793B2 (en) 1986-08-26

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