JPS56122153A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56122153A
JPS56122153A JP2503280A JP2503280A JPS56122153A JP S56122153 A JPS56122153 A JP S56122153A JP 2503280 A JP2503280 A JP 2503280A JP 2503280 A JP2503280 A JP 2503280A JP S56122153 A JPS56122153 A JP S56122153A
Authority
JP
Japan
Prior art keywords
evaporator
tube
condenser
size
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2503280A
Other languages
Japanese (ja)
Other versions
JPS5941307B2 (en
Inventor
Haruo Tetsuno
Tamotsu Nishino
Masaru Kamibayashi
Toshio Mikane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2503280A priority Critical patent/JPS5941307B2/en
Publication of JPS56122153A publication Critical patent/JPS56122153A/en
Publication of JPS5941307B2 publication Critical patent/JPS5941307B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the size between a condenser and an evaporator in height direction in a boiling cooling type semiconductor device by varying the connection structure of a heat transrfer tube. CONSTITUTION:A hole 4A is perforated at the center, the outer periphery 4B of disc-shaped bellows 4 having coaxial bent part 4C is connected to a condenser 3, and the hole 4A is connected to one end of an insulating tube 6. The other end of the tube 6 is connected to the evaporator 1. A hollow pipe formed of insulator is provided within a heat transfer tube 2 to circulate the cooling medium 8 in liquid phase to the bottom of the evaporator 1. Thus, the mounting and dismounting of a semiconductor element can be readily conducted, the size of the height of the heat transfer tube, i.e., between the condenser and the evaporator is reduced, and the semiconductor of small size can be manufactured.
JP2503280A 1980-02-28 1980-02-28 Boiling cooling device for semiconductor devices Expired JPS5941307B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2503280A JPS5941307B2 (en) 1980-02-28 1980-02-28 Boiling cooling device for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2503280A JPS5941307B2 (en) 1980-02-28 1980-02-28 Boiling cooling device for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS56122153A true JPS56122153A (en) 1981-09-25
JPS5941307B2 JPS5941307B2 (en) 1984-10-05

Family

ID=12154563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2503280A Expired JPS5941307B2 (en) 1980-02-28 1980-02-28 Boiling cooling device for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5941307B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0429188A2 (en) * 1989-10-26 1991-05-29 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US10712099B2 (en) * 2017-07-06 2020-07-14 Kabushiki Kaisha Toshiba Heat pipe

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62155820U (en) * 1986-03-24 1987-10-03
JPH02220672A (en) * 1989-02-23 1990-09-03 Gijutsu Kenkyu Kumiai Iryo Fukushi Kiki Kenkyusho Laser fiber catheter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0429188A2 (en) * 1989-10-26 1991-05-29 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
EP0429188A3 (en) * 1989-10-26 1991-11-06 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5195577A (en) * 1989-10-26 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Cooling device for power semiconductor switching elements
US10712099B2 (en) * 2017-07-06 2020-07-14 Kabushiki Kaisha Toshiba Heat pipe

Also Published As

Publication number Publication date
JPS5941307B2 (en) 1984-10-05

Similar Documents

Publication Publication Date Title
US4036291A (en) Cooling device for electric device
US3170512A (en) Heat exchanger
US3609206A (en) Evaporative cooling system for insulated bus
US2829271A (en) Heat conductive insulating support
JPS56122153A (en) Semiconductor device
US4899211A (en) Semiconductor cooling mechanisms
JPS5749787A (en) Boiling cooler
JPH0334231B2 (en)
US1934475A (en) Electric capacitor
JPS56115549A (en) Semiconductor device
JPS56122152A (en) Semiconductor device
JPS56122151A (en) Semiconductor device
US2736175A (en) Electrically operated absorption
US2431097A (en) Electron discharge device
JPH04196154A (en) Semiconductor cooling device
JPS6130292Y2 (en)
JPS5919897Y2 (en) electrically insulated heat pipe
JPS59805Y2 (en) High frequency dummy load using steam heat exchanger
SU1554031A1 (en) Screened cryostat for magnetic measurements
JPH0429554Y2 (en)
JPS5979920U (en) gas insulated bushings
JPS5795591A (en) Evaporator for a boiling and cooling device
JPS5732532A (en) Hermetic cathode-supporting member for electron gun
JPS55128778A (en) Heat exchanger
JPS5745265A (en) Semiconductor device