JPS56122150A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56122150A
JPS56122150A JP2502980A JP2502980A JPS56122150A JP S56122150 A JPS56122150 A JP S56122150A JP 2502980 A JP2502980 A JP 2502980A JP 2502980 A JP2502980 A JP 2502980A JP S56122150 A JPS56122150 A JP S56122150A
Authority
JP
Japan
Prior art keywords
evaporator
parallel elements
semiconductor element
tube
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2502980A
Other languages
Japanese (ja)
Other versions
JPS6127914B2 (en
Inventor
Haruo Tetsuno
Shogo Itano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2502980A priority Critical patent/JPS56122150A/en
Publication of JPS56122150A publication Critical patent/JPS56122150A/en
Publication of JPS6127914B2 publication Critical patent/JPS6127914B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To cool a semiconductor device with high reliability by mounting parallel elements connected in parallel with a semiconductor element in a liquid storage container and connecting the parallel elements via conductors passed through the heat transfer tube to an evaporator. CONSTITUTION:A semiconductor element 1 is pressed by an evaporator 6, and parallel elements 3 are connected via conductors 5 passed through an insulating tube 9A and bellows 9B forming a heat transfer tube 9 to the evaporator 6. The heat generated at the semiconductor element 1 is transferred to the evaporator 6 to boil cooling medium 12 making contact with the evaporator 6, the medium 12 thus becomes gaseous phase, the heat is thus transferred from the tube 9 to a container 7 and cooled at a condenser to be liquefied and returned to the original position. On the other hand, it is also cooled even at the parallel elements. Thus, airtight terminal or the like is not necessary in electric connection and it improves the reliability in the airtightness and cooling operation.
JP2502980A 1980-02-28 1980-02-28 Semiconductor device Granted JPS56122150A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2502980A JPS56122150A (en) 1980-02-28 1980-02-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2502980A JPS56122150A (en) 1980-02-28 1980-02-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56122150A true JPS56122150A (en) 1981-09-25
JPS6127914B2 JPS6127914B2 (en) 1986-06-27

Family

ID=12154478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2502980A Granted JPS56122150A (en) 1980-02-28 1980-02-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56122150A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899211A (en) * 1986-01-16 1990-02-06 Jeumont Schneider Corporation Semiconductor cooling mechanisms

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899211A (en) * 1986-01-16 1990-02-06 Jeumont Schneider Corporation Semiconductor cooling mechanisms

Also Published As

Publication number Publication date
JPS6127914B2 (en) 1986-06-27

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