JPS56129325A - Dry etching - Google Patents

Dry etching

Info

Publication number
JPS56129325A
JPS56129325A JP3221480A JP3221480A JPS56129325A JP S56129325 A JPS56129325 A JP S56129325A JP 3221480 A JP3221480 A JP 3221480A JP 3221480 A JP3221480 A JP 3221480A JP S56129325 A JPS56129325 A JP S56129325A
Authority
JP
Japan
Prior art keywords
photo etching
photo
output
final point
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3221480A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0237089B2 (enrdf_load_stackoverflow
Inventor
Minoru Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3221480A priority Critical patent/JPS56129325A/ja
Publication of JPS56129325A publication Critical patent/JPS56129325A/ja
Publication of JPH0237089B2 publication Critical patent/JPH0237089B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP3221480A 1980-03-14 1980-03-14 Dry etching Granted JPS56129325A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3221480A JPS56129325A (en) 1980-03-14 1980-03-14 Dry etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3221480A JPS56129325A (en) 1980-03-14 1980-03-14 Dry etching

Publications (2)

Publication Number Publication Date
JPS56129325A true JPS56129325A (en) 1981-10-09
JPH0237089B2 JPH0237089B2 (enrdf_load_stackoverflow) 1990-08-22

Family

ID=12352665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3221480A Granted JPS56129325A (en) 1980-03-14 1980-03-14 Dry etching

Country Status (1)

Country Link
JP (1) JPS56129325A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58218121A (ja) * 1982-06-11 1983-12-19 Anelva Corp シリコンのドライエツチングモニタリング方法
JPS5928340A (ja) * 1982-08-09 1984-02-15 Hitachi Ltd エッチング終点検出方法
JPS59159984A (ja) * 1983-03-03 1984-09-10 Matsushita Electric Ind Co Ltd ドライエッチング装置
WO2020188632A1 (ja) * 2019-03-15 2020-09-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、記録媒体および基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556407A (en) * 1978-06-26 1980-01-17 Hitachi Ltd Etching method for aluminum
JPS5524941A (en) * 1978-08-09 1980-02-22 Tokuda Seisakusho Ltd Dry etching apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556407A (en) * 1978-06-26 1980-01-17 Hitachi Ltd Etching method for aluminum
JPS5524941A (en) * 1978-08-09 1980-02-22 Tokuda Seisakusho Ltd Dry etching apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58218121A (ja) * 1982-06-11 1983-12-19 Anelva Corp シリコンのドライエツチングモニタリング方法
JPS5928340A (ja) * 1982-08-09 1984-02-15 Hitachi Ltd エッチング終点検出方法
JPS59159984A (ja) * 1983-03-03 1984-09-10 Matsushita Electric Ind Co Ltd ドライエッチング装置
WO2020188632A1 (ja) * 2019-03-15 2020-09-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、記録媒体および基板処理装置
TWI744759B (zh) * 2019-03-15 2021-11-01 日商國際電氣股份有限公司 半導體裝置的製造方法，記錄媒體及基板處理裝置
JPWO2020188632A1 (ja) * 2019-03-15 2021-12-02 株式会社Kokusai Electric 半導体装置の製造方法、基板処理方法、プログラムおよび基板処理装置

Also Published As

Publication number Publication date
JPH0237089B2 (enrdf_load_stackoverflow) 1990-08-22

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