JPS5612778A - Impatt diode device - Google Patents

Impatt diode device

Info

Publication number
JPS5612778A
JPS5612778A JP8703579A JP8703579A JPS5612778A JP S5612778 A JPS5612778 A JP S5612778A JP 8703579 A JP8703579 A JP 8703579A JP 8703579 A JP8703579 A JP 8703579A JP S5612778 A JPS5612778 A JP S5612778A
Authority
JP
Japan
Prior art keywords
diode chip
matching circuit
matching
trimming
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8703579A
Other languages
Japanese (ja)
Inventor
Hideyo Hasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8703579A priority Critical patent/JPS5612778A/en
Publication of JPS5612778A publication Critical patent/JPS5612778A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/864—Transit-time diodes, e.g. IMPATT, TRAPATT diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To reduce a great amount of work required for circuit adjustments by containing a diode chip and a matching circuit in a case. CONSTITUTION:A diode chip 1 is mounted on a case base platform 6 and connected to a matching circuit 4 through a bonding wire 2. The matching circuit 4 is composed of a metal pattern formed on a dielectric substrate 3 such as ceramic, quartz or the like. Trimming is slightly done in accordance with variations in the impedance characteristics of the diode chip 1 to materialize the optimum matching. After mounting the diode chip 1 on the case base platform 6 and connecting the diode chip 1 to the matching circuit 4 on the ceramic substrate 3 by the bonding wire 2, the optimum trimming for the matching circuit 4 is performed. Then, the diode chip 1 is hermetically sealed by a cap 7.
JP8703579A 1979-07-10 1979-07-10 Impatt diode device Pending JPS5612778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8703579A JPS5612778A (en) 1979-07-10 1979-07-10 Impatt diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8703579A JPS5612778A (en) 1979-07-10 1979-07-10 Impatt diode device

Publications (1)

Publication Number Publication Date
JPS5612778A true JPS5612778A (en) 1981-02-07

Family

ID=13903686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8703579A Pending JPS5612778A (en) 1979-07-10 1979-07-10 Impatt diode device

Country Status (1)

Country Link
JP (1) JPS5612778A (en)

Similar Documents

Publication Publication Date Title
JPS53149763A (en) Mounting method of semiconductor integrate circuit
JPS5721829A (en) Manufacture of semiconductor device
JPS5779652A (en) Resin-sealed semiconductor device
GB1463023A (en) Hermetically sealed package including an integrated circuit
JPS5612778A (en) Impatt diode device
EP0338213A3 (en) Semiconductor device with a metal package
JPS55166941A (en) Semiconductor device
JPS56126951A (en) Semicondutor device
JPS6473753A (en) Semiconductor integrated circuit device
JPS56148857A (en) Semiconductor device
JPS6489546A (en) Semiconductor device
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS56148840A (en) Mounting structure for ic
JPS6410651A (en) Packaging method for hybrid integrated circuit
JPS5240972A (en) Packaging construction of semiconductor device
JPS55103747A (en) Manufacture of semiconductor device
JPS554979A (en) Semiconductor device manufacturing method
JPS5561045A (en) Packaging device for semiconductor integrated circuit
JPS54114975A (en) Semiconductor device
JPS5761983A (en) Electronic wristwatch
JPS5240974A (en) Package for semiconductor chips
JPS55148450A (en) Semiconductor device
JPS57145335A (en) Semiconductor device
JPS53117969A (en) Regeneration of semiconductor device
JPS55157254A (en) Digital-to-analog converter