JPS56125849A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56125849A JPS56125849A JP2850580A JP2850580A JPS56125849A JP S56125849 A JPS56125849 A JP S56125849A JP 2850580 A JP2850580 A JP 2850580A JP 2850580 A JP2850580 A JP 2850580A JP S56125849 A JPS56125849 A JP S56125849A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- gold
- diamond
- covering
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 7
- 229910052737 gold Inorganic materials 0.000 abstract 7
- 239000010931 gold Substances 0.000 abstract 7
- 229910003460 diamond Inorganic materials 0.000 abstract 4
- 239000010432 diamond Substances 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2850580A JPS56125849A (en) | 1980-03-06 | 1980-03-06 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2850580A JPS56125849A (en) | 1980-03-06 | 1980-03-06 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56125849A true JPS56125849A (en) | 1981-10-02 |
| JPH0131295B2 JPH0131295B2 (enrdf_load_stackoverflow) | 1989-06-26 |
Family
ID=12250531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2850580A Granted JPS56125849A (en) | 1980-03-06 | 1980-03-06 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56125849A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001031082A1 (en) * | 1999-10-28 | 2001-05-03 | P1 Diamond, Inc. | Improved diamond thermal management components |
| US6281574B1 (en) * | 1999-09-27 | 2001-08-28 | Raytheon Company | High power microwave transistor amplifier |
-
1980
- 1980-03-06 JP JP2850580A patent/JPS56125849A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6281574B1 (en) * | 1999-09-27 | 2001-08-28 | Raytheon Company | High power microwave transistor amplifier |
| WO2001031082A1 (en) * | 1999-10-28 | 2001-05-03 | P1 Diamond, Inc. | Improved diamond thermal management components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0131295B2 (enrdf_load_stackoverflow) | 1989-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6418246A (en) | Lead frame for semiconductor device | |
| JPS5753947A (en) | Transistor and electronic device containing it | |
| JPS57100737A (en) | Semiconductor device | |
| JPS5769765A (en) | Sealed body of semiconductor device | |
| JPS56125849A (en) | Semiconductor device | |
| DE3473972D1 (en) | Semiconductor device comprising a substrate | |
| JPS53119675A (en) | Mounting structure of lsi | |
| JPS56146263A (en) | Manufacture of semiconductor device | |
| JPS57136352A (en) | Semiconductor device of resin potted type | |
| JPS57211259A (en) | Semiconductor device | |
| JPS57121260A (en) | Semiconductor device | |
| JPS5382168A (en) | Lead frame for semiconductor device | |
| JPS5559754A (en) | Semiconductor device | |
| JPS53121490A (en) | Semiconductor device | |
| JPS5736852A (en) | Circuit substrate and manufacture thereof | |
| JPS52141566A (en) | Semiconductor device and its manufacture | |
| JPS55103747A (en) | Manufacture of semiconductor device | |
| JPS5739540A (en) | Semiconductor device | |
| JPS57178334A (en) | Semiconductor device and manufacture therfof | |
| JPS5739557A (en) | Semiconductor device | |
| JPS5772338A (en) | Manufacture of semiconductor device | |
| JPS56105670A (en) | Semiconductor device | |
| JPS5314564A (en) | Bonding method of s# chip and substrate | |
| JPS547271A (en) | Semiconductor electrode structure | |
| JPS57109350A (en) | Semiconductor device |