JPH0131295B2 - - Google Patents

Info

Publication number
JPH0131295B2
JPH0131295B2 JP2850580A JP2850580A JPH0131295B2 JP H0131295 B2 JPH0131295 B2 JP H0131295B2 JP 2850580 A JP2850580 A JP 2850580A JP 2850580 A JP2850580 A JP 2850580A JP H0131295 B2 JPH0131295 B2 JP H0131295B2
Authority
JP
Japan
Prior art keywords
heat sink
container
diamond
gold
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2850580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56125849A (en
Inventor
Hiroyuki Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP2850580A priority Critical patent/JPS56125849A/ja
Publication of JPS56125849A publication Critical patent/JPS56125849A/ja
Publication of JPH0131295B2 publication Critical patent/JPH0131295B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2850580A 1980-03-06 1980-03-06 Semiconductor device Granted JPS56125849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2850580A JPS56125849A (en) 1980-03-06 1980-03-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2850580A JPS56125849A (en) 1980-03-06 1980-03-06 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56125849A JPS56125849A (en) 1981-10-02
JPH0131295B2 true JPH0131295B2 (enrdf_load_stackoverflow) 1989-06-26

Family

ID=12250531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2850580A Granted JPS56125849A (en) 1980-03-06 1980-03-06 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56125849A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281574B1 (en) * 1999-09-27 2001-08-28 Raytheon Company High power microwave transistor amplifier
WO2001031082A1 (en) * 1999-10-28 2001-05-03 P1 Diamond, Inc. Improved diamond thermal management components

Also Published As

Publication number Publication date
JPS56125849A (en) 1981-10-02

Similar Documents

Publication Publication Date Title
US5506446A (en) Electronic package having improved wire bonding capability
US6261868B1 (en) Semiconductor component and method for manufacturing the semiconductor component
US4480013A (en) Substrate for use in semiconductor apparatus
US4266090A (en) All metal flat package
US3387191A (en) Strain relieving transition member for contacting semiconductor devices
US4649229A (en) All metal flat package for microcircuitry
US20020060356A1 (en) Power semiconductor device
JPH0936186A (ja) パワー半導体モジュール及びその実装方法
JP3336982B2 (ja) 半導体装置およびその製造方法
US3296501A (en) Metallic ceramic composite contacts for semiconductor devices
US3303265A (en) Miniature semiconductor enclosure
JPH0131295B2 (enrdf_load_stackoverflow)
JP2019114575A (ja) 半導体装置およびその製造方法
US3280383A (en) Electronic semiconductor device
US3471752A (en) Semiconductor device with an insulating body interposed between a semiconductor element and a part of a casing
JP4514598B2 (ja) 電子部品収納用パッケージおよび電子装置
US6914330B2 (en) Heat sink formed of diamond-containing composite material with a multilayer coating
JPH09129823A (ja) 半導体装置
JP3522975B2 (ja) 半導体装置
JP2006114601A (ja) 蓋体と電子部品用パッケージ
JPH03238865A (ja) 半導体素子
JPS5998566A (ja) ヒ−トシンク
KR100282177B1 (ko) 레이저 다이오드의 본딩 구조
JP2571571Y2 (ja) 半導体素子収納用パッケージ
JP2619155B2 (ja) 混成集積回路装置