JPS56120177A - Semiconductor luminescence device - Google Patents

Semiconductor luminescence device

Info

Publication number
JPS56120177A
JPS56120177A JP2371280A JP2371280A JPS56120177A JP S56120177 A JPS56120177 A JP S56120177A JP 2371280 A JP2371280 A JP 2371280A JP 2371280 A JP2371280 A JP 2371280A JP S56120177 A JPS56120177 A JP S56120177A
Authority
JP
Japan
Prior art keywords
lens
casing
light
transmittible
yield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2371280A
Other languages
Japanese (ja)
Inventor
Hideto Furuyama
Yutaka Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2371280A priority Critical patent/JPS56120177A/en
Publication of JPS56120177A publication Critical patent/JPS56120177A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To intend to increase the yield by sticking a spherical lens inside a light introducing window of a casing and sealing airtightly against a luminous zone of a semiconductor element. CONSTITUTION:A part of a sphere lense is worked evenly and fixedly adhered to the light introducing window 4 of the casing 5 with a light transmittible silicone resin adhesive 6. The casing 5 is arranged on a stem 3 on which the luminous element 2 is fixed. After setting the position of a lens with the luminous zone of the element 2, the airtight sealing is performed. According to this construction, since an aperture occurs between the element 2 and the lens 1, the element characteristics can be fully taken out without causing the stress to the element. Further, since the optical positioning can be performed simply, there is no need of treating a small lens or an element directly, and the simplification of the work and the increase of the yield are possible. Furthermore, the shortening the distance between the lens and the element is effectively performed by setting a impact buffer material 8 such as a light transmittible silicon resin group adhesive or the like between the element and the lens.
JP2371280A 1980-02-27 1980-02-27 Semiconductor luminescence device Pending JPS56120177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2371280A JPS56120177A (en) 1980-02-27 1980-02-27 Semiconductor luminescence device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2371280A JPS56120177A (en) 1980-02-27 1980-02-27 Semiconductor luminescence device

Publications (1)

Publication Number Publication Date
JPS56120177A true JPS56120177A (en) 1981-09-21

Family

ID=12117949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2371280A Pending JPS56120177A (en) 1980-02-27 1980-02-27 Semiconductor luminescence device

Country Status (1)

Country Link
JP (1) JPS56120177A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2593930A1 (en) * 1986-01-24 1987-08-07 Radiotechnique Compelec OPTOELECTRONIC DEVICE FOR SURFACE MOUNTING
JPS6444088A (en) * 1987-08-12 1989-02-16 Seiko Epson Corp Semiconductor laser
JPH0245657U (en) * 1988-09-22 1990-03-29
WO1998037603A1 (en) * 1997-02-18 1998-08-27 Siemens Aktiengesellschaft Laser device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2593930A1 (en) * 1986-01-24 1987-08-07 Radiotechnique Compelec OPTOELECTRONIC DEVICE FOR SURFACE MOUNTING
JPS6444088A (en) * 1987-08-12 1989-02-16 Seiko Epson Corp Semiconductor laser
JPH0245657U (en) * 1988-09-22 1990-03-29
WO1998037603A1 (en) * 1997-02-18 1998-08-27 Siemens Aktiengesellschaft Laser device

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