JPS648681A - Manufacture of photosemiconductor device - Google Patents

Manufacture of photosemiconductor device

Info

Publication number
JPS648681A
JPS648681A JP62164246A JP16424687A JPS648681A JP S648681 A JPS648681 A JP S648681A JP 62164246 A JP62164246 A JP 62164246A JP 16424687 A JP16424687 A JP 16424687A JP S648681 A JPS648681 A JP S648681A
Authority
JP
Japan
Prior art keywords
ring
cap
secured
lens
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62164246A
Other languages
Japanese (ja)
Inventor
Tsuneo Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62164246A priority Critical patent/JPS648681A/en
Publication of JPS648681A publication Critical patent/JPS648681A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To reduce the deviation of an optical axis and to improve manufacturing yield by interposing a solder ring between a stem to which a light emitting element pellet is secured and a cap to which a ball lens or a rod lens is secured, malting the ring by high frequency heating, and sealing the stem and the cap. CONSTITUTION:A solder ring 2 is interposed between a cap 1 with a ball ring 4 and a step 3 to which a light emitting element 5 is secured, and optical axes of the pellet 5 and the lens 4 are regulated. Then, the ring 2 is melted by high frequency heating on the outer peripheries of the cap 1 and the step 2 in this state and sealed. As a result, an optical semiconductor device in which the deviation of the optical axis is reduced and manufacturing yield is improved is obtained.
JP62164246A 1987-06-30 1987-06-30 Manufacture of photosemiconductor device Pending JPS648681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62164246A JPS648681A (en) 1987-06-30 1987-06-30 Manufacture of photosemiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62164246A JPS648681A (en) 1987-06-30 1987-06-30 Manufacture of photosemiconductor device

Publications (1)

Publication Number Publication Date
JPS648681A true JPS648681A (en) 1989-01-12

Family

ID=15789452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62164246A Pending JPS648681A (en) 1987-06-30 1987-06-30 Manufacture of photosemiconductor device

Country Status (1)

Country Link
JP (1) JPS648681A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456131A2 (en) * 1990-05-07 1991-11-13 Omron Corporation Photoelectric sensor
EP1271498A2 (en) * 2001-06-19 2003-01-02 Mitsumi Electric Co., Ltd. Method of fixing a laser diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456131A2 (en) * 1990-05-07 1991-11-13 Omron Corporation Photoelectric sensor
EP1271498A2 (en) * 2001-06-19 2003-01-02 Mitsumi Electric Co., Ltd. Method of fixing a laser diode

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