JPS56120154A - Coil and its manufacture - Google Patents

Coil and its manufacture

Info

Publication number
JPS56120154A
JPS56120154A JP2321980A JP2321980A JPS56120154A JP S56120154 A JPS56120154 A JP S56120154A JP 2321980 A JP2321980 A JP 2321980A JP 2321980 A JP2321980 A JP 2321980A JP S56120154 A JPS56120154 A JP S56120154A
Authority
JP
Japan
Prior art keywords
metallic
coil
strip piece
prepd
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2321980A
Other languages
Japanese (ja)
Inventor
Hironari Mannami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP2321980A priority Critical patent/JPS56120154A/en
Publication of JPS56120154A publication Critical patent/JPS56120154A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/004—Printed inductances with the coil helically wound around an axis without a core

Abstract

PURPOSE:To obtain a coil by providing a metallic film pattern in an insulation film on the surface of a semiconductor and connecting the said pattern to a metallic film pattern formed through the intermediary of an insulation film. CONSTITUTION:An epitaxial layer 2 on a silicon substrate 1 is separated 12 and is coated with a silicon oxide film 3. An n-p-n transistor is prepd. in a region T and a metallic strip piece 4 is prepd. in a region L at the same time as an electrode 15 for the transistor. Next, an insulation film of desired thickness 5 is overlaid to set a prearranged coil cross-sectional area. Then an opening is made at the end of the strip piece 4 and a metallic strip piece 6 is prepd. through the coating/patterning of the strip piece with a metallic film. With this constitution, it is possible to form a coil easily, utilizing the molding process of a circuit element for an integrated circuit.
JP2321980A 1980-02-26 1980-02-26 Coil and its manufacture Pending JPS56120154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2321980A JPS56120154A (en) 1980-02-26 1980-02-26 Coil and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2321980A JPS56120154A (en) 1980-02-26 1980-02-26 Coil and its manufacture

Publications (1)

Publication Number Publication Date
JPS56120154A true JPS56120154A (en) 1981-09-21

Family

ID=12104537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2321980A Pending JPS56120154A (en) 1980-02-26 1980-02-26 Coil and its manufacture

Country Status (1)

Country Link
JP (1) JPS56120154A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09219468A (en) * 1996-12-09 1997-08-19 Shinko Electric Ind Co Ltd Electronic component base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09219468A (en) * 1996-12-09 1997-08-19 Shinko Electric Ind Co Ltd Electronic component base

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