JPS56116656A - Manufacturing of high-density wiring pattern - Google Patents

Manufacturing of high-density wiring pattern

Info

Publication number
JPS56116656A
JPS56116656A JP2016580A JP2016580A JPS56116656A JP S56116656 A JPS56116656 A JP S56116656A JP 2016580 A JP2016580 A JP 2016580A JP 2016580 A JP2016580 A JP 2016580A JP S56116656 A JPS56116656 A JP S56116656A
Authority
JP
Japan
Prior art keywords
resist
metal
wiring pattern
pattern
layer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0143476B2 (enrdf_load_stackoverflow
Inventor
Hikari Kimura
Tatsuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2016580A priority Critical patent/JPS56116656A/ja
Publication of JPS56116656A publication Critical patent/JPS56116656A/ja
Publication of JPH0143476B2 publication Critical patent/JPH0143476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2016580A 1980-02-19 1980-02-19 Manufacturing of high-density wiring pattern Granted JPS56116656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016580A JPS56116656A (en) 1980-02-19 1980-02-19 Manufacturing of high-density wiring pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016580A JPS56116656A (en) 1980-02-19 1980-02-19 Manufacturing of high-density wiring pattern

Publications (2)

Publication Number Publication Date
JPS56116656A true JPS56116656A (en) 1981-09-12
JPH0143476B2 JPH0143476B2 (enrdf_load_stackoverflow) 1989-09-20

Family

ID=12019538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016580A Granted JPS56116656A (en) 1980-02-19 1980-02-19 Manufacturing of high-density wiring pattern

Country Status (1)

Country Link
JP (1) JPS56116656A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01196144A (ja) * 1987-12-11 1989-08-07 Texas Instr Inc <Ti> 相互接続線上に自己整合された導電性の柱を持つ装置の製造方法
US9274048B2 (en) 2010-02-16 2016-03-01 Hamamatsu Photonics K.K. Gas concentration calculation device and gas concentration measurement module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3342927A (en) * 1966-01-10 1967-09-19 Gen Dynamics Corp Weldable tab for printed circuits and method of fabrication

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3342927A (en) * 1966-01-10 1967-09-19 Gen Dynamics Corp Weldable tab for printed circuits and method of fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01196144A (ja) * 1987-12-11 1989-08-07 Texas Instr Inc <Ti> 相互接続線上に自己整合された導電性の柱を持つ装置の製造方法
US9274048B2 (en) 2010-02-16 2016-03-01 Hamamatsu Photonics K.K. Gas concentration calculation device and gas concentration measurement module

Also Published As

Publication number Publication date
JPH0143476B2 (enrdf_load_stackoverflow) 1989-09-20

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