JPS56112772A - Light emitting semiconductor device - Google Patents

Light emitting semiconductor device

Info

Publication number
JPS56112772A
JPS56112772A JP1554280A JP1554280A JPS56112772A JP S56112772 A JPS56112772 A JP S56112772A JP 1554280 A JP1554280 A JP 1554280A JP 1554280 A JP1554280 A JP 1554280A JP S56112772 A JPS56112772 A JP S56112772A
Authority
JP
Japan
Prior art keywords
light emitting
light
filter
band
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1554280A
Other languages
Japanese (ja)
Inventor
Makoto Morioka
Masahiro Ichiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1554280A priority Critical patent/JPS56112772A/en
Publication of JPS56112772A publication Critical patent/JPS56112772A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To provide the light emitting semiconductor device adapted for a light source for a light communication capable of constructing a system having high multiplexing degree by forming a band pass filter including predetermined transmitting characteristic on the light emitting surface of the light emitting element utilizing the mitted light with the p-n junction. CONSTITUTION:The light emitting element having a light emitting body 1 of p type GaAlAs, a p type diffused layer 2 and an n type diffused layer 3 is mounted via an Au electrode 5 on a heat dissipating substrate 6 formed of Cu or the like. A film 12 becoming a filter having a transmitting wavelength specified for a level of the wavelength band used for the element and narrower band than that predetermined band is covered on the surface of the body 1 becoming the light emitting surface. The light of the predetermined wavelength passing through the filter 12 is transmitted to the optical fiber 9. A reflection preventive film (not shown) may be formed between the filter 12 and the light emitting surface.
JP1554280A 1980-02-13 1980-02-13 Light emitting semiconductor device Pending JPS56112772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1554280A JPS56112772A (en) 1980-02-13 1980-02-13 Light emitting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1554280A JPS56112772A (en) 1980-02-13 1980-02-13 Light emitting semiconductor device

Publications (1)

Publication Number Publication Date
JPS56112772A true JPS56112772A (en) 1981-09-05

Family

ID=11891673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1554280A Pending JPS56112772A (en) 1980-02-13 1980-02-13 Light emitting semiconductor device

Country Status (1)

Country Link
JP (1) JPS56112772A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075819A2 (en) * 2001-03-15 2002-09-26 Osram Opto Semiconductors Gmbh Radiation-emitting optical component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075819A2 (en) * 2001-03-15 2002-09-26 Osram Opto Semiconductors Gmbh Radiation-emitting optical component
WO2002075819A3 (en) * 2001-03-15 2003-04-17 Osram Opto Semiconductors Gmbh Radiation-emitting optical component
US8039855B2 (en) 2001-03-15 2011-10-18 Osram Gmbh Radiation-emitting optical component

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