JPS56111213A - Preparation of thin film semiconductor device - Google Patents

Preparation of thin film semiconductor device

Info

Publication number
JPS56111213A
JPS56111213A JP15580A JP15580A JPS56111213A JP S56111213 A JPS56111213 A JP S56111213A JP 15580 A JP15580 A JP 15580A JP 15580 A JP15580 A JP 15580A JP S56111213 A JPS56111213 A JP S56111213A
Authority
JP
Japan
Prior art keywords
film
substrate
semiconductor device
thin film
polycrystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15580A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP15580A priority Critical patent/JPS56111213A/en
Publication of JPS56111213A publication Critical patent/JPS56111213A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To prevent the deformation of the substrate, by forming a single crystal by means of laser radiation the polycrystalline or amorphous Si film stacked on the substrate by providing a photoreflective film through a dielectric film. CONSTITUTION:On the substrate 10, glass or some organic compound whose melting point is lower than that of Si, an Al reflective film is evaporated and further an SiO2 12 and an amorphous or a polycrystalline Si thin film 13 are stacked. A conversion into a single crystal is performed by laser radiation 14. At this time, because the laser beam is reflected by the reflective film 11, the temperature of the substrate 11 is not elevated. The reflected element heats the Si film effectively. With such an arrangement, the materials with lower melting point, lower softening point and degradation at lower temperature can be made use of to lower the cost, and the semiconductor device can be formed on a flexible sheet.
JP15580A 1980-01-07 1980-01-07 Preparation of thin film semiconductor device Pending JPS56111213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15580A JPS56111213A (en) 1980-01-07 1980-01-07 Preparation of thin film semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15580A JPS56111213A (en) 1980-01-07 1980-01-07 Preparation of thin film semiconductor device

Publications (1)

Publication Number Publication Date
JPS56111213A true JPS56111213A (en) 1981-09-02

Family

ID=11466147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15580A Pending JPS56111213A (en) 1980-01-07 1980-01-07 Preparation of thin film semiconductor device

Country Status (1)

Country Link
JP (1) JPS56111213A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837927A (en) * 1981-08-28 1983-03-05 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS60127745A (en) * 1983-12-14 1985-07-08 Matsushita Electric Ind Co Ltd Semiconductor substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837927A (en) * 1981-08-28 1983-03-05 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPH0221144B2 (en) * 1981-08-28 1990-05-11 Matsushita Electric Ind Co Ltd
JPS60127745A (en) * 1983-12-14 1985-07-08 Matsushita Electric Ind Co Ltd Semiconductor substrate

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