JPS56105474A - Target for magnetron sputtering - Google Patents

Target for magnetron sputtering

Info

Publication number
JPS56105474A
JPS56105474A JP660580A JP660580A JPS56105474A JP S56105474 A JPS56105474 A JP S56105474A JP 660580 A JP660580 A JP 660580A JP 660580 A JP660580 A JP 660580A JP S56105474 A JPS56105474 A JP S56105474A
Authority
JP
Japan
Prior art keywords
target
magnetic force
force line
strip
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP660580A
Other languages
Japanese (ja)
Inventor
Kiyotaka Wasa
Shigeru Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP660580A priority Critical patent/JPS56105474A/en
Publication of JPS56105474A publication Critical patent/JPS56105474A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Abstract

PURPOSE:To provide the long-life titled target capable of reducing local sputter evaporation phenomenon and of developing a uniform sputter evaporation by arranging a high magnetic permeable long strip in the direction crossing magnetic force line of perpendicular electromagnetic field, in sputter surface. CONSTITUTION:This target 11 is to generate crosswise magnetic force line in the gap between a magnet 23 and an ion piece 25 by providing a highly permeable long strip 31 on the rear surface of the target 11, in the direction at right angle to the magnetic force line. That is, the strip 31 devides the magnetic force line on the target 11 in the direction at right angle to the magnetic force line, as shown by marks 32. As a result, sputter evaporation area is extended from the area 33 to surface, thus increasing uniformness of evaporation in the target surface 11. At sputtering time, the temperature on the target surface often reaches to 200-300 deg.C or higher, so a ferromagnetic material is preferable as a strip 31. For example, preferable material is a single body of Ni, Co, Fe, etc. or Permalloy and Sendust.
JP660580A 1980-01-22 1980-01-22 Target for magnetron sputtering Pending JPS56105474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP660580A JPS56105474A (en) 1980-01-22 1980-01-22 Target for magnetron sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP660580A JPS56105474A (en) 1980-01-22 1980-01-22 Target for magnetron sputtering

Publications (1)

Publication Number Publication Date
JPS56105474A true JPS56105474A (en) 1981-08-21

Family

ID=11642967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP660580A Pending JPS56105474A (en) 1980-01-22 1980-01-22 Target for magnetron sputtering

Country Status (1)

Country Link
JP (1) JPS56105474A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338576A (en) * 1986-08-01 1988-02-19 Anelva Corp Sputtering device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338576A (en) * 1986-08-01 1988-02-19 Anelva Corp Sputtering device

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