JPS56103455A - Semiconductor ic device - Google Patents
Semiconductor ic deviceInfo
- Publication number
- JPS56103455A JPS56103455A JP600780A JP600780A JPS56103455A JP S56103455 A JPS56103455 A JP S56103455A JP 600780 A JP600780 A JP 600780A JP 600780 A JP600780 A JP 600780A JP S56103455 A JPS56103455 A JP S56103455A
- Authority
- JP
- Japan
- Prior art keywords
- pads
- lsi
- projecting electrodes
- chips
- heating value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP600780A JPS56103455A (en) | 1980-01-22 | 1980-01-22 | Semiconductor ic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP600780A JPS56103455A (en) | 1980-01-22 | 1980-01-22 | Semiconductor ic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56103455A true JPS56103455A (en) | 1981-08-18 |
JPH0127582B2 JPH0127582B2 (de) | 1989-05-30 |
Family
ID=11626663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP600780A Granted JPS56103455A (en) | 1980-01-22 | 1980-01-22 | Semiconductor ic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56103455A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
US9731887B2 (en) | 2012-02-24 | 2017-08-15 | Boru International Co. Ltd. | Rubber seal for vacuum receptacle and lid for the receptacle using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51102566A (en) * | 1975-03-07 | 1976-09-10 | Suwa Seikosha Kk | Shusekikairo |
JPS5394075U (de) * | 1976-12-28 | 1978-08-01 |
-
1980
- 1980-01-22 JP JP600780A patent/JPS56103455A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51102566A (en) * | 1975-03-07 | 1976-09-10 | Suwa Seikosha Kk | Shusekikairo |
JPS5394075U (de) * | 1976-12-28 | 1978-08-01 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
JPS6347259B2 (de) * | 1981-11-27 | 1988-09-21 | Mitsubishi Electric Corp | |
US9731887B2 (en) | 2012-02-24 | 2017-08-15 | Boru International Co. Ltd. | Rubber seal for vacuum receptacle and lid for the receptacle using the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0127582B2 (de) | 1989-05-30 |
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