JPS56103433A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS56103433A
JPS56103433A JP537780A JP537780A JPS56103433A JP S56103433 A JPS56103433 A JP S56103433A JP 537780 A JP537780 A JP 537780A JP 537780 A JP537780 A JP 537780A JP S56103433 A JPS56103433 A JP S56103433A
Authority
JP
Japan
Prior art keywords
bonding
stage
detected
itvs
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP537780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349375B2 (enrdf_load_stackoverflow
Inventor
Chiaki Iwadare
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP537780A priority Critical patent/JPS56103433A/ja
Publication of JPS56103433A publication Critical patent/JPS56103433A/ja
Publication of JPS6349375B2 publication Critical patent/JPS6349375B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP537780A 1980-01-21 1980-01-21 Wire bonding method Granted JPS56103433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP537780A JPS56103433A (en) 1980-01-21 1980-01-21 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP537780A JPS56103433A (en) 1980-01-21 1980-01-21 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS56103433A true JPS56103433A (en) 1981-08-18
JPS6349375B2 JPS6349375B2 (enrdf_load_stackoverflow) 1988-10-04

Family

ID=11609476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP537780A Granted JPS56103433A (en) 1980-01-21 1980-01-21 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS56103433A (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022574A (enrdf_load_stackoverflow) * 1973-06-26 1975-03-11
JPS5160910A (ja) * 1974-11-25 1976-05-27 Hitachi Ltd Riniamoota
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device
JPS55138246A (en) * 1979-04-13 1980-10-28 Toshiba Corp Manufacture of semicondoctor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022574A (enrdf_load_stackoverflow) * 1973-06-26 1975-03-11
JPS5160910A (ja) * 1974-11-25 1976-05-27 Hitachi Ltd Riniamoota
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device
JPS55138246A (en) * 1979-04-13 1980-10-28 Toshiba Corp Manufacture of semicondoctor device

Also Published As

Publication number Publication date
JPS6349375B2 (enrdf_load_stackoverflow) 1988-10-04

Similar Documents

Publication Publication Date Title
JPS56103433A (en) Wire bonding method
JPS5243355A (en) Test data transfer device for electric particle line eqipment
JPS5378828A (en) Electric piano
JPS57147245A (en) Positioning method and device for chip bonding
JPS5266173A (en) Method for detecting the trouble at output contact
JPS5231670A (en) Assembling method of semiconductor integrated circuit element
JPS523316A (en) Local connecting system in circuit collecting device
JPS5292742A (en) Measuring method for welding groove gap
JPS5249768A (en) Method of assembling semiconductor device
JPS51135474A (en) To analyze a semiconductor device
JPS51145981A (en) An automatic assembling machine for small parts
JPS5212572A (en) Semi-conductor device
AT342467B (de) Vorrichtung zur drahtbrucherfassung an verseilmaschinen
JPS52134723A (en) Coupling system of flash device for camera
JPS51127678A (en) Semiconductor device and its manufacturing method
JPS5311455A (en) Posture control device
JPS5223268A (en) Method of detecting attaching positions of semiconductor pellets
JPS5762548A (en) Semiconductor device
JPS5325356A (en) Wire bonding device
JPS5249812A (en) Automatic assembling device
JPS5717140A (en) Wire bonding device
JPS5323669A (en) Small electronic device
JPS51145887A (en) Cord testing device
JPS5376071A (en) Electronic circuit device for electronic watch
JPS52122125A (en) Method and device for detecting correct focusing based on focusing information at different times