JPS56103428A - Sensing method of wafer limit - Google Patents

Sensing method of wafer limit

Info

Publication number
JPS56103428A
JPS56103428A JP529980A JP529980A JPS56103428A JP S56103428 A JPS56103428 A JP S56103428A JP 529980 A JP529980 A JP 529980A JP 529980 A JP529980 A JP 529980A JP S56103428 A JPS56103428 A JP S56103428A
Authority
JP
Japan
Prior art keywords
wafer
sensed
moved
die
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP529980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410934B2 (cg-RX-API-DMAC10.html
Inventor
Kazuhiro Hayakawa
Masayuki Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP529980A priority Critical patent/JPS56103428A/ja
Publication of JPS56103428A publication Critical patent/JPS56103428A/ja
Publication of JPS6410934B2 publication Critical patent/JPS6410934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W46/00—
    • H10W46/501—

Landscapes

  • Die Bonding (AREA)
JP529980A 1980-01-22 1980-01-22 Sensing method of wafer limit Granted JPS56103428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP529980A JPS56103428A (en) 1980-01-22 1980-01-22 Sensing method of wafer limit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP529980A JPS56103428A (en) 1980-01-22 1980-01-22 Sensing method of wafer limit

Publications (2)

Publication Number Publication Date
JPS56103428A true JPS56103428A (en) 1981-08-18
JPS6410934B2 JPS6410934B2 (cg-RX-API-DMAC10.html) 1989-02-22

Family

ID=11607361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP529980A Granted JPS56103428A (en) 1980-01-22 1980-01-22 Sensing method of wafer limit

Country Status (1)

Country Link
JP (1) JPS56103428A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181543A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 半導体マウント装置
JPS60207348A (ja) * 1984-03-31 1985-10-18 Toshiba Seiki Kk ウエハ中心の検出装置
JPS62214310A (ja) * 1986-03-17 1987-09-21 Toshiba Seiki Kk ウエハ外径の検出方法
JPH0412549A (ja) * 1990-05-01 1992-01-17 Rohm Co Ltd 半導体ペレットのピックアップ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181543A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 半導体マウント装置
JPS60207348A (ja) * 1984-03-31 1985-10-18 Toshiba Seiki Kk ウエハ中心の検出装置
JPS62214310A (ja) * 1986-03-17 1987-09-21 Toshiba Seiki Kk ウエハ外径の検出方法
JPH0412549A (ja) * 1990-05-01 1992-01-17 Rohm Co Ltd 半導体ペレットのピックアップ装置

Also Published As

Publication number Publication date
JPS6410934B2 (cg-RX-API-DMAC10.html) 1989-02-22

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