JPS5598826A - Heat treatment jig for semiconductor wafer - Google Patents

Heat treatment jig for semiconductor wafer

Info

Publication number
JPS5598826A
JPS5598826A JP695879A JP695879A JPS5598826A JP S5598826 A JPS5598826 A JP S5598826A JP 695879 A JP695879 A JP 695879A JP 695879 A JP695879 A JP 695879A JP S5598826 A JPS5598826 A JP S5598826A
Authority
JP
Japan
Prior art keywords
wafers
heat treatment
grooves
jig
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP695879A
Other languages
Japanese (ja)
Inventor
Osamu Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP695879A priority Critical patent/JPS5598826A/en
Publication of JPS5598826A publication Critical patent/JPS5598826A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To attain a uniform layer resistance or oxide film thickness, by providing a wafer heat treatment jig for heat treatment including diffusion and oxidation, with side wall grooves for setting up numerous wafers at a spacing and by causing the grooves to extend obliquely at 5W50° to the flowing direction of a fluid.
CONSTITUTION: Numerous semiconductor wafers 8 are set up at a spacing on a wafer heat treatment jig 1. The jig is inserted into a furnace core pipe 2. A prescribed fluid is caused to flow from a nozzle 3 provided on one end of the pipe 2 to raise the temperature of the wafers for diffusion, oxidation or the like. Grooves 5, in which the edges of the wafers 8 are fitted, are provided on two parallel wafer support bars 4 mounted on the quartz jig. Reinforcing bars 6 are secured on the outsides of the support bars 4. The grooves 5 extend not perpendicularly to the flowing direction 7 of gas but obliquely at 5W50° to the direction 7. As a result, the flow of the gas is changed and revolved by the wafers 8 and the quantity of the gas which comes into contact with the surface of each wafer is made kept constant.
COPYRIGHT: (C)1980,JPO&Japio
JP695879A 1979-01-23 1979-01-23 Heat treatment jig for semiconductor wafer Pending JPS5598826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP695879A JPS5598826A (en) 1979-01-23 1979-01-23 Heat treatment jig for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP695879A JPS5598826A (en) 1979-01-23 1979-01-23 Heat treatment jig for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5598826A true JPS5598826A (en) 1980-07-28

Family

ID=11652723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP695879A Pending JPS5598826A (en) 1979-01-23 1979-01-23 Heat treatment jig for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5598826A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
JPH01199424A (en) * 1987-10-08 1989-08-10 Tadahiro Omi Thin film depositing process and device thereof
US5582649A (en) * 1996-02-29 1996-12-10 The United States Of America As Represented By The Secretary Of The Air Force Wafer transfer apparatus for use in a film deposition furnace

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
JPH01199424A (en) * 1987-10-08 1989-08-10 Tadahiro Omi Thin film depositing process and device thereof
US5582649A (en) * 1996-02-29 1996-12-10 The United States Of America As Represented By The Secretary Of The Air Force Wafer transfer apparatus for use in a film deposition furnace

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