JPS5594975A - Low expansion powder composition for bonding use - Google Patents

Low expansion powder composition for bonding use

Info

Publication number
JPS5594975A
JPS5594975A JP227579A JP227579A JPS5594975A JP S5594975 A JPS5594975 A JP S5594975A JP 227579 A JP227579 A JP 227579A JP 227579 A JP227579 A JP 227579A JP S5594975 A JPS5594975 A JP S5594975A
Authority
JP
Japan
Prior art keywords
low expansion
powder
compsn
powder composition
bonding use
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP227579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6220143B2 (enrdf_load_stackoverflow
Inventor
Keiichiro Suzuki
Jiro Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP227579A priority Critical patent/JPS5594975A/ja
Publication of JPS5594975A publication Critical patent/JPS5594975A/ja
Publication of JPS6220143B2 publication Critical patent/JPS6220143B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Glass Compositions (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP227579A 1979-01-16 1979-01-16 Low expansion powder composition for bonding use Granted JPS5594975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP227579A JPS5594975A (en) 1979-01-16 1979-01-16 Low expansion powder composition for bonding use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP227579A JPS5594975A (en) 1979-01-16 1979-01-16 Low expansion powder composition for bonding use

Publications (2)

Publication Number Publication Date
JPS5594975A true JPS5594975A (en) 1980-07-18
JPS6220143B2 JPS6220143B2 (enrdf_load_stackoverflow) 1987-05-06

Family

ID=11524806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP227579A Granted JPS5594975A (en) 1979-01-16 1979-01-16 Low expansion powder composition for bonding use

Country Status (1)

Country Link
JP (1) JPS5594975A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988851A (ja) * 1982-11-12 1984-05-22 Ibiden Co Ltd 電子回路用炭化珪素質基板の製造方法
JPS62275074A (ja) * 1986-05-21 1987-11-30 工業技術院長 非酸化物セラミツクス用接着剤、非酸化物セラミツクス用接着剤シ−ト及び非酸化物セラミツクスの接着方法
JPS62275075A (ja) * 1986-05-22 1987-11-30 工業技術院長 非酸化物セラミツクスの接着方法
US4777092A (en) * 1986-05-02 1988-10-11 Asahi Glass Company, Ltd. Composition for ceramic substrate and substrate
JPS6451346A (en) * 1987-08-18 1989-02-27 Asahi Glass Co Ltd Glass ceramic composition
JPH01226749A (ja) * 1988-03-08 1989-09-11 Ngk Insulators Ltd セラミック接合ガラス組成物
JP2014094855A (ja) * 2012-11-08 2014-05-22 Toshiba Corp 炭化ケイ素セラミックス接合体及び炭化ケイ素セラミックス接合体の製造方法
JP2020518549A (ja) * 2017-05-05 2020-06-25 チャイナ タバコ フゥベイ インダストリアル コーポレーション リミテッド 複合セラミック噴霧器及びその製造方法
CN112851389A (zh) * 2021-04-14 2021-05-28 哈尔滨工业大学 一种使用氧化钙/氧化铝/二氧化硅/氧化锂玻璃焊料连接SiC陶瓷材料的方法
CN113666766A (zh) * 2021-09-14 2021-11-19 长春工业大学 一种玻璃焊料渗透连接氧化锆陶瓷的方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793011B2 (en) 2012-11-21 2017-10-17 Hitachi, Ltd. Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924208A (enrdf_load_stackoverflow) * 1972-06-30 1974-03-04
JPS5256867A (en) * 1975-10-31 1977-05-10 Jenaer Glaswerk Schott & Gen Glass for hermetic coating and stabilization of surface
JPS5317608A (en) * 1976-08-02 1978-02-17 Hitachi Ltd Passivation glass for semiconductor apparatus
JPS5945616A (ja) * 1982-09-08 1984-03-14 Fuji Xerox Co Ltd 垂直磁気記録再生ヘツド

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924208A (enrdf_load_stackoverflow) * 1972-06-30 1974-03-04
JPS5256867A (en) * 1975-10-31 1977-05-10 Jenaer Glaswerk Schott & Gen Glass for hermetic coating and stabilization of surface
JPS5317608A (en) * 1976-08-02 1978-02-17 Hitachi Ltd Passivation glass for semiconductor apparatus
JPS5945616A (ja) * 1982-09-08 1984-03-14 Fuji Xerox Co Ltd 垂直磁気記録再生ヘツド

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988851A (ja) * 1982-11-12 1984-05-22 Ibiden Co Ltd 電子回路用炭化珪素質基板の製造方法
US4777092A (en) * 1986-05-02 1988-10-11 Asahi Glass Company, Ltd. Composition for ceramic substrate and substrate
JPS62275074A (ja) * 1986-05-21 1987-11-30 工業技術院長 非酸化物セラミツクス用接着剤、非酸化物セラミツクス用接着剤シ−ト及び非酸化物セラミツクスの接着方法
JPS62275075A (ja) * 1986-05-22 1987-11-30 工業技術院長 非酸化物セラミツクスの接着方法
JPS6451346A (en) * 1987-08-18 1989-02-27 Asahi Glass Co Ltd Glass ceramic composition
JPH01226749A (ja) * 1988-03-08 1989-09-11 Ngk Insulators Ltd セラミック接合ガラス組成物
JP2014094855A (ja) * 2012-11-08 2014-05-22 Toshiba Corp 炭化ケイ素セラミックス接合体及び炭化ケイ素セラミックス接合体の製造方法
JP2020518549A (ja) * 2017-05-05 2020-06-25 チャイナ タバコ フゥベイ インダストリアル コーポレーション リミテッド 複合セラミック噴霧器及びその製造方法
CN112851389A (zh) * 2021-04-14 2021-05-28 哈尔滨工业大学 一种使用氧化钙/氧化铝/二氧化硅/氧化锂玻璃焊料连接SiC陶瓷材料的方法
CN112851389B (zh) * 2021-04-14 2022-03-15 哈尔滨工业大学 一种使用氧化钙/氧化铝/二氧化硅/氧化锂玻璃焊料连接SiC陶瓷材料的方法
CN113666766A (zh) * 2021-09-14 2021-11-19 长春工业大学 一种玻璃焊料渗透连接氧化锆陶瓷的方法

Also Published As

Publication number Publication date
JPS6220143B2 (enrdf_load_stackoverflow) 1987-05-06

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