JPS5593239A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5593239A
JPS5593239A JP50579A JP50579A JPS5593239A JP S5593239 A JPS5593239 A JP S5593239A JP 50579 A JP50579 A JP 50579A JP 50579 A JP50579 A JP 50579A JP S5593239 A JPS5593239 A JP S5593239A
Authority
JP
Japan
Prior art keywords
particle
radiated
electron
malfunction
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6157704B2 (enrdf_load_stackoverflow
Inventor
Kazuo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50579A priority Critical patent/JPS5593239A/ja
Publication of JPS5593239A publication Critical patent/JPS5593239A/ja
Publication of JPS6157704B2 publication Critical patent/JPS6157704B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Die Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
JP50579A 1979-01-04 1979-01-04 Semiconductor device Granted JPS5593239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50579A JPS5593239A (en) 1979-01-04 1979-01-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50579A JPS5593239A (en) 1979-01-04 1979-01-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5593239A true JPS5593239A (en) 1980-07-15
JPS6157704B2 JPS6157704B2 (enrdf_load_stackoverflow) 1986-12-08

Family

ID=11475615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50579A Granted JPS5593239A (en) 1979-01-04 1979-01-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5593239A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598846A (en) * 1979-01-22 1980-07-28 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device
JPS5630745A (en) * 1979-08-22 1981-03-27 Fujitsu Ltd Semiconductor device
JPS5970347U (ja) * 1982-11-02 1984-05-12 ティーディーケイ株式会社 集積回路装置
JPS61107119A (ja) * 1984-10-30 1986-05-26 Hamamatsu Photonics Kk セラミツク容器を用いたシリコンホトセル
JPS62281358A (ja) * 1986-05-29 1987-12-07 Nec Kyushu Ltd 半導体装置
US4866498A (en) * 1988-04-20 1989-09-12 The United States Department Of Energy Integrated circuit with dissipative layer for photogenerated carriers
US4975762A (en) * 1981-06-11 1990-12-04 General Electric Ceramics, Inc. Alpha-particle-emitting ceramic composite cover

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416718U (enrdf_load_stackoverflow) * 1987-07-20 1989-01-27

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598846A (en) * 1979-01-22 1980-07-28 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device
JPS5630745A (en) * 1979-08-22 1981-03-27 Fujitsu Ltd Semiconductor device
US4975762A (en) * 1981-06-11 1990-12-04 General Electric Ceramics, Inc. Alpha-particle-emitting ceramic composite cover
JPS5970347U (ja) * 1982-11-02 1984-05-12 ティーディーケイ株式会社 集積回路装置
JPS61107119A (ja) * 1984-10-30 1986-05-26 Hamamatsu Photonics Kk セラミツク容器を用いたシリコンホトセル
JPS62281358A (ja) * 1986-05-29 1987-12-07 Nec Kyushu Ltd 半導体装置
US4866498A (en) * 1988-04-20 1989-09-12 The United States Department Of Energy Integrated circuit with dissipative layer for photogenerated carriers

Also Published As

Publication number Publication date
JPS6157704B2 (enrdf_load_stackoverflow) 1986-12-08

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