JPS5586136A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPS5586136A JPS5586136A JP16162778A JP16162778A JPS5586136A JP S5586136 A JPS5586136 A JP S5586136A JP 16162778 A JP16162778 A JP 16162778A JP 16162778 A JP16162778 A JP 16162778A JP S5586136 A JPS5586136 A JP S5586136A
- Authority
- JP
- Japan
- Prior art keywords
- film
- peeled
- substrates
- plate
- discharges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To prevent damaging IC elements on semiconductor substrates by scattering static electricity over a wide area which is generated when peeling off plastic films from the substrates and preventing the generation of discharges.
CONSTITUTION: Substrates 1 on which IC elements have been formed are sandwhiched between two pressure sensitive adhesive plastic films 2 and 2' and adhered, and then separated into chips. These processed matters are placed on a conductive base 3, and on the film 2 to be peeled, a thin plate 4 of electric conductivity below 1014 ohm.cm is placed and the film 2 is peeled off along with the plate 4. By this method, the film 2' contacts the conductive base 3, the peeled film 2 contacts the conductive plate 4 and generated static electricity is scattered, therefore, discharges do not occur and IC element connections or insulating films are not damaged.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16162778A JPS5586136A (en) | 1978-12-23 | 1978-12-23 | Preparation of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16162778A JPS5586136A (en) | 1978-12-23 | 1978-12-23 | Preparation of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5586136A true JPS5586136A (en) | 1980-06-28 |
Family
ID=15738770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16162778A Pending JPS5586136A (en) | 1978-12-23 | 1978-12-23 | Preparation of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5586136A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59219939A (en) * | 1983-05-27 | 1984-12-11 | Mitsubishi Electric Corp | Manufacture of semiconductor element |
JPS61214587A (en) * | 1985-03-20 | 1986-09-24 | Toshiba Corp | Manufacture of semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4913081U (en) * | 1972-05-08 | 1974-02-04 |
-
1978
- 1978-12-23 JP JP16162778A patent/JPS5586136A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4913081U (en) * | 1972-05-08 | 1974-02-04 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59219939A (en) * | 1983-05-27 | 1984-12-11 | Mitsubishi Electric Corp | Manufacture of semiconductor element |
JPS61214587A (en) * | 1985-03-20 | 1986-09-24 | Toshiba Corp | Manufacture of semiconductor device |
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